Inventor · disambiguated record
I-Jye Lin
Also filed as: LIN I-JYE
3 granted patents·1 citations·filing 2010–2022
50Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0158US12489021B1Determining a density of through-silicon vias in integrated circuitsSYNOPSYS INC·Filed 2022·Granted Dec 2, 2025·0 cites·14 claims
- 0258US8875083B2Routing method for flip chip package and apparatus using the sameSYNOPSYS INC·Filed 2013·Granted Oct 28, 2014·1 cites·9 claims
- 0340US8578317B2Routing method for flip chip package and apparatus using the sameCHANG CHEN-FENG·Filed 2010·Granted Nov 5, 2013·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →