Inventor · disambiguated record
Hongbin Shi
Also filed as: SHI HONGBIN
9 granted patents·3 pending applications·10 citations·filing 2013–2021
79Inventor score
Files withHUAWEI TECH CO LTD5SHI HONGBIN3SAMSUNG ELECTRONICS CO LTD2ALIBABA GROUP HOLDING LTD1ZTE CORP1
Top patents by PatentIndex Score
12 records- 0184US9985008B2Method of fabricating a semiconductor packageSHI HONGBIN·Filed 2017·Granted May 29, 2018·6 cites·16 claims
- 0263US10050020B2Stack-type semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 14, 2018·1 cites·20 claims
- 0362US11011477B2High-reliability electronic packaging structure, circuit board, and deviceHUAWEI TECH CO LTD·Filed 2017·Granted May 18, 2021·1 cites·19 claims
- 0457US9953964B2Method for manufacturing semiconductor packageSHI HONGBIN·Filed 2016·Granted Apr 24, 2018·1 cites·15 claims
- 0554US9786644B2Methods of fabricating a semiconductor packageSHI HONGBIN·Filed 2016·Granted Oct 10, 2017·1 cites·20 claims
- 0646US12369249B2Printed circuit board assembly and electronic deviceHUAWEI TECH CO LTD·Filed 2021·Granted Jul 22, 2025·0 cites·16 claims
- 0746US2016342974A1Wireless mobile payment deviceALIBABA GROUP HOLDING LTD·Filed 2016·Application pending·0 cites
- 0845US2023337362A1Electronic component and electronic deviceHUAWEI TECH CO LTD·Filed 2021·Application pending·0 cites
- 0944US2022394853A1Circuit Board Assembly, Electronic Device, and Method for Processing Circuit Board AssemblyHUAWEI TECH CO LTD·Filed 2020·Application pending·0 cites
- 1041US9590798B2Synchronization system, method and master/slave optical module device for detecting asymmetry of optical fibersZTE CORP·Filed 2013·Granted Mar 7, 2017·0 cites·18 claims
- 1136US11367700B2Electronic package, terminal and method for processing electronic packageHUAWEI TECH CO LTD·Filed 2017·Granted Jun 21, 2022·0 cites·18 claims
- 1236US9728516B2Electric apparatus including electric patterns for suppressing solder bridgesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 8, 2017·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →