Inventor · disambiguated record
Tomoaki Hirokawa
Also filed as: HIROKAWA TOMOAKI
8 granted patents·1 pending application·155 citations·filing 1997–2009
88Inventor score
Top patents by PatentIndex Score
9 records- 0173US6011303AElectronic componentNEC CORP·Filed 1997·Granted Jan 4, 2000·48 cites·20 claims
- 0273US5905301AMold package for sealing a chipNEC CORP·Filed 1997·Granted May 18, 1999·45 cites·16 claims
- 0356US5889232AUltrahigh-frequency electronic componentNEC CORP·Filed 1997·Granted Mar 30, 1999·19 cites·1 claims
- 0450US5970322AUltrahigh-frequency electronic component and method of manufacturing the sameNEC CORP·Filed 1998·Granted Oct 19, 1999·15 cites·3 claims
- 0548US6703678B2Schottky barrier field effect transistor large in withstanding voltage and small in distortion and return-lossNEC COMPOUND SEMICONDUCTOR·Filed 2001·Granted Mar 9, 2004·6 cites·13 claims
- 0642US2009288852A1Electronic device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 0740US5904501AHollow package manufacturing methodNEC CORP·Filed 1997·Granted May 18, 1999·9 cites·7 claims
- 0836US5956574ALead frame flash removing method and apparatusNEC CORP·Filed 1997·Granted Sep 21, 1999·7 cites·6 claims
- 0935US6340792B1Mold cap for semiconductor device mold packageNEC CORP·Filed 1997·Granted Jan 22, 2002·6 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →