Inventor · disambiguated record
Yude Chu
Also filed as: CHU YUDE
8 granted patents·1 pending application·34 citations·filing 2001–2016
76Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD9
Top patents by PatentIndex Score
9 records- 0181US6781222B2Semiconductor package having vertically mounted passive devices under a chip and a fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Aug 24, 2004·34 cites·20 claims
- 0251US9337250B2Semiconductor package and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted May 10, 2016·0 cites·3 claims
- 0349US9502758B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 22, 2016·0 cites·24 claims
- 0448US10587037B2Electronic package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Mar 10, 2020·0 cites·20 claims
- 0547US9997477B2Method of manufacturing semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Jun 12, 2018·0 cites·4 claims
- 0643US9502377B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Nov 22, 2016·0 cites·11 claims
- 0743US9355989B2Wire bonding device and method of eliminating defective bonding wireSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted May 31, 2016·0 cites·10 claims
- 0838US9289846B2Method for fabricating wire bonding structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Mar 22, 2016·0 cites·7 claims
- 0932US2016081234A1Package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →