Inventor · disambiguated record

Liu Wuping

Also filed as: WUPING LIU

2 granted patents·51 citations·filing 2003–2005

65Inventor score

Technology areasH10W

Files withCHARTERED SEMICONDUCTOR MFG2

Top patents by PatentIndex Score

2 records

0182US6998335B2Structure and method for fabricating a bond pad structureCHARTERED SEMICONDUCTOR MFG·Filed 2003·Granted Feb 14, 2006·39 cites·25 claims
0281US7276797B2Structure and method for fabricating a bond pad structureCHARTERED SEMICONDUCTOR MFG·Filed 2005·Granted Oct 2, 2007·12 cites·14 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →