Inventor · disambiguated record
Tomotaka Fujisawa
Also filed as: FUJISAWA TOMOTAKA
12 granted patents·1 pending application·103 citations·filing 1994–2008
90Inventor score
Top patents by PatentIndex Score
13 records- 0170US6649958B2Semiconductor device with MIS capacitors sharing dielectric filmSONY CORP·Filed 2001·Granted Nov 18, 2003·15 cites·5 claims
- 0269US6380602B1Semiconductor deviceSONY CORP·Filed 2000·Granted Apr 30, 2002·17 cites·20 claims
- 0366US8664031B2Method of manufacturing photodiode intergrated chipFUJISAWA TOMOTAKA·Filed 2008·Granted Mar 4, 2014·2 cites·3 claims
- 0465US6858513B2Method for manufacturing a semiconductor device with MIS capacitors with dielectric film in commonSONY CORP·Filed 2002·Granted Feb 22, 2005·11 cites·2 claims
- 0564US5414291ASemiconductor device and process for fabricating the sameSONY CORP·Filed 1994·Granted May 9, 1995·20 cites·7 claims
- 0661US5622887AProcess for fabricating BiCMOS devices including passive devicesSONY CORP·Filed 1994·Granted Apr 22, 1997·18 cites·2 claims
- 0752US6798001B2Semiconductor device having photo diode with sensitivity to light of different wavelengthsSONY CORP·Filed 2001·Granted Sep 28, 2004·5 cites·8 claims
- 0848US7893515B2Photodetector integrated chipSONY CORP·Filed 2001·Granted Feb 22, 2011·2 cites·19 claims
- 0948US2010237454A1Light-receiving device and method for manufacturing light-receiving deviceSONY CORP·Filed 2007·Application pending·0 cites
- 1044US6445057B1Semiconductor device having a trimming circuit for suppressing leakage currentSONY CORP·Filed 2000·Granted Sep 3, 2002·2 cites·4 claims
- 1143US5998302AMethod of manufacturing semiconductor deviceSONY CORP·Filed 1998·Granted Dec 7, 1999·11 cites·17 claims
- 1236US6756280B2Semiconductor device and a process for producing sameSONY CORP·Filed 2003·Granted Jun 29, 2004·0 cites·4 claims
- 1336US6642605B2Semiconductor device and a process for producing sameSONY CORP·Filed 2002·Granted Nov 4, 2003·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →