Inventor · disambiguated record
Joong-Do Kim
Also filed as: KIM JOONG-DO
7 granted patents·148 citations·filing 1997–2005
87Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0174US5767574ASemiconductor lead frameSAMSUNG AEROSPACE IND·Filed 1997·Granted Jun 16, 1998·48 cites·9 claims
- 0266US7501692B2Semiconductor lead frame, semiconductor package having the same, and method of plating the sameSAMSUNG TECHWIN CO LTD·Filed 2005·Granted Mar 10, 2009·4 cites·16 claims
- 0363US6037653ASemiconductor lead frame having multi-layered plating layer including copper-nickel plating layerSAMSUNG AEROSPACE IND·Filed 1998·Granted Mar 14, 2000·33 cites·6 claims
- 0456US5958607ALead frame for semiconductor deviceSAMSUNG AEROSPACE IND·Filed 1997·Granted Sep 28, 1999·22 cites·4 claims
- 0552US6087712ALead frame containing leads plated with tin alloy for increased wettability and method for plating the leadsSAMSUNG AEROSPACE IND·Filed 1997·Granted Jul 11, 2000·19 cites·8 claims
- 0644US5977620ALead frame having a Ni-Mn alloy layer and a Pd layerSAMSUNG AEROSPACE IND·Filed 1998·Granted Nov 2, 1999·13 cites·8 claims
- 0738US6017777AMethod of forming a plating layer of a lead frameSAMSUNG AEROSPACE IND·Filed 1997·Granted Jan 25, 2000·9 cites·17 claims
Join the waitlist — get patent alerts
Get an alert when Joong-Do Kim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →