Inventor · disambiguated record
Seong Hyun Yoo
Also filed as: YOO SEONG HYUN
5 granted patents·16 pending applications·21 citations·filing 1999–2019
74Inventor score
Top patents by PatentIndex Score
21 records- 0179US8105663B2Composition for forming substrate, and prepreg and substrate using the sameLEE KEUN YONG·Filed 2009·Granted Jan 31, 2012·6 cites·21 claims
- 0277US8822832B2Epoxy resin composition for printed circuit board, insulating film, prepreg, and multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Granted Sep 2, 2014·2 cites·21 claims
- 0374US10938090B2Antenna moduleSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 2, 2021·2 cites·20 claims
- 0450US9107307B2Resin composition for printed circuit board, insulating film, prepreg, and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 11, 2015·0 cites·14 claims
- 0550US2014106147A1Prepreg, copper clad laminate, and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 0648US2014066545A1Epoxy resin composition for printed circuit board, insulating film, prepreg, and multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 0747US2015057393A1Insulating resin composition for printed circuit board and products manufactured by using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 0847US2014063427A1Resin composition for thermal radiation board and thermal radiation board comprising the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 0947US2014367147A1Insulating resin composition for printed circuit board, insulating film, prepreg and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1046US2015147542A1Resin composition for printed circuit board and printed circuit board comprising the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1146US2015104630A1Prepreg for printed circuit board, manufacturing method thereof, and printed circuit board including the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1246US2015065608A1Insulating resin composition for printed circuit board and products manufactured by using the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1345US2015114693A1Insulating resin composition for printed circuit board and products manufactured by using the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1445US2017086292A1Prepreg and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 1545US2014002226A1Inductor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1645US2014034367A1Epoxy resin composition for pritned circuit board, insulating film, prepreg, and multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1744US2014127483A1Copper-clad laminate. method for manufacturing the same, and printed circuit board including the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1842US2015107760A1Carrier and method of manufacturing printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1941US2014079924A1Resin composition for package substrate and package substrate comprising core layer and prepreg using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2040US6486240B1Method for producing an asymmetric support membrane by physical gelation and the membranes obtained therebyKOREA INST SCI & TECH·Filed 1999·Granted Nov 26, 2002·11 cites·3 claims
- 2136US2016237303A1Resin composition for printed circuit board, insulating film, and printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →