Inventor · disambiguated record
Jen-Chun Chen
Also filed as: CHEN JEN-CHUN
11 granted patents·1 pending application·80 citations·filing 2008–2017
88Inventor score
Files withUNIVERSAL SCIENT IND SHANGHAI6UNIVERSAL SCIENT IND (SHANGHAI) CO LTD2CHEN JEN-CHUN1NANYA TECHNOLOGY CORP1O2MICRO INC1
Top patents by PatentIndex Score
12 records- 0191US8022523B2Multi-chip stack packageNANYA TECHNOLOGY CORP·Filed 2008·Granted Sep 20, 2011·25 cites·8 claims
- 0290US9332646B2Electronic package module and method of manufacturing the sameUNIVERSAL SCIENT IND SHANGHAI·Filed 2013·Granted May 3, 2016·14 cites·19 claims
- 0386US9144183B2EMI compartment shielding structure and fabricating method thereofUNIVERSAL SCIENT IND SHANGHAI·Filed 2013·Granted Sep 22, 2015·20 cites·14 claims
- 0481US9271436B2Electronic packaged device and manufacturing method thereofUNIVERSAL SCIENT IND SHANGHAI·Filed 2014·Granted Feb 23, 2016·6 cites·15 claims
- 0579US10660176B2System and method for driving light source comprising voltage feedback circuit and current feedback circuitO2MICRO INC·Filed 2017·Granted May 19, 2020·3 cites·16 claims
- 0669US9089046B2Electronic module and method for sameUNIVERSAL SCIENT IND SHANGHAI·Filed 2013·Granted Jul 21, 2015·3 cites·17 claims
- 0768US8338929B2Stacked-type chip package structure and fabrication method thereofCHEN JEN-CHUN·Filed 2008·Granted Dec 25, 2012·6 cites·20 claims
- 0861US9674991B2Electronic packaged deviceUNIVERSAL SCIENT IND (SHANGHAI) CO LTD·Filed 2015·Granted Jun 6, 2017·1 cites·4 claims
- 0960US9881875B2Electronic module and method of making the sameUNIVERSAL SCIENT INDUSTRIAL (SHANGHAI) CO LTD·Filed 2014·Granted Jan 30, 2018·1 cites·18 claims
- 1059US9171770B2Electronic device and manufacturing method thereofUNIVERSAL SCIENT IND SHANGHAI·Filed 2013·Granted Oct 27, 2015·1 cites·14 claims
- 1142US9814166B2Method of manufacturing electronic package moduleUNIVERSAL SCIENT IND ( SHANGHAI) CO LTD·Filed 2013·Granted Nov 7, 2017·0 cites·4 claims
- 1240US2015214075A1Manufacturing method of selective electronic packaging deviceUNIVERSAL SCIENT IND SHANGHAI·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →