Inventor · disambiguated record
Meiquan Huang
Also filed as: Huang meiquan
6 granted patents·1 pending application·8 citations·filing 2010–2014
72Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0167US8288847B2Dual die semiconductor packageHuang meiquan·Filed 2010·Granted Oct 16, 2012·4 cites·11 claims
- 0261US8496158B2Method and apparatus for monitoring free air ball (FAB) formation in wire bondingZONG FEI·Filed 2012·Granted Jul 30, 2013·3 cites·15 claims
- 0358US8907464B2Helix substrate and three-dimensional package with sameWANG HUAN·Filed 2013·Granted Dec 9, 2014·1 cites·8 claims
- 0448US9129948B2Semiconductor device and method of assembling sameFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Sep 8, 2015·0 cites·8 claims
- 0542US8878348B2Semiconductor device and method of assembling sameHuang meiquan·Filed 2013·Granted Nov 4, 2014·0 cites·20 claims
- 0635US8524529B2Brace for wire bondHuang meiquan·Filed 2011·Granted Sep 3, 2013·0 cites·13 claims
- 0734US2012326288A1Method of assembling semiconductor deviceHuang meiquan·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →