Inventor · disambiguated record
Kevin Guan
Also filed as: GUAN KEVIN
6 granted patents·11 citations·filing 2007–2010
75Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0172US8357563B2Stitch bump stacking design for overall package size reduction for multiple stackSPANSION LLC·Filed 2010·Granted Jan 22, 2013·5 cites·14 claims
- 0262US7932131B2Reduction of package height in a stacked die configurationSPANSION LLC·Filed 2007·Granted Apr 26, 2011·4 cites·17 claims
- 0361US7674653B2Die offset die to bondingSPANSION LLC·Filed 2008·Granted Mar 9, 2010·2 cites·3 claims
- 0449US7750481B2Die offset die to die bondingSPANSION LLC·Filed 2008·Granted Jul 6, 2010·0 cites·5 claims
- 0546US7554204B2Die offset die to die bondingSPANSION LLC·Filed 2007·Granted Jun 30, 2009·0 cites·8 claims
- 0626US8680686B2Method and system for thin multi chip stack package with film on wire and copper wireCHIN LAI NGUK·Filed 2010·Granted Mar 25, 2014·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →