Inventor · disambiguated record
Wong Kwet Nam
Also filed as: NAM WONG KWET
4 granted patents·7 citations·filing 2004–2010
63Inventor score
Top patents by PatentIndex Score
4 records- 0172US8357563B2Stitch bump stacking design for overall package size reduction for multiple stackSPANSION LLC·Filed 2010·Granted Jan 22, 2013·5 cites·14 claims
- 0241US7157376B1Method and apparatus for handling thin semiconductor wafersADVANCED MICRO DEVICES INC·Filed 2004·Granted Jan 2, 2007·2 cites·6 claims
- 0334US7799612B2Process applying die attach film to singulated dieSPANSION LLC·Filed 2007·Granted Sep 21, 2010·0 cites·16 claims
- 0426US8680686B2Method and system for thin multi chip stack package with film on wire and copper wireCHIN LAI NGUK·Filed 2010·Granted Mar 25, 2014·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →