Inventor · disambiguated record
Foong Yue Ho
Also filed as: HO FOONG YUE
3 granted patents·9 citations·filing 2007–2010
60Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0172US8357563B2Stitch bump stacking design for overall package size reduction for multiple stackSPANSION LLC·Filed 2010·Granted Jan 22, 2013·5 cites·14 claims
- 0262US7932131B2Reduction of package height in a stacked die configurationSPANSION LLC·Filed 2007·Granted Apr 26, 2011·4 cites·17 claims
- 0326US8680686B2Method and system for thin multi chip stack package with film on wire and copper wireCHIN LAI NGUK·Filed 2010·Granted Mar 25, 2014·0 cites·13 claims
Join the waitlist — get patent alerts
Get an alert when Foong Yue Ho files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →