Inventor · disambiguated record
Hirotaka Yoshioka
Also filed as: YOSHIOKA HIROTAKA
8 granted patents·9 pending applications·25 citations·filing 2013–2024
78Inventor score
Files withSONY SEMICONDUCTOR SOLUTIONS CORP11NIPPON TELEGRAPH & TELEPHONE3SONY CORP2NIDEC ELESYS CORP1
Top patents by PatentIndex Score
17 records- 0194US8946797B2Solid-state imaging device, method of manufacturing solid-state imaging device, apparatus for manufacturing semiconductor device, method of manufacturing semiconductor device, and electronic deviceSONY CORP·Filed 2013·Granted Feb 3, 2015·20 cites·8 claims
- 0284US9419040B2Image pickup apparatus, semiconductor device, and electronic device including a buried portion disposed adjacent to a bonding portion, and method for manufacturing the sameSONY CORP·Filed 2015·Granted Aug 16, 2016·4 cites·14 claims
- 0380US12107103B2Imaging apparatus and electronic equipment for peeling off prevention in lensSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Oct 1, 2024·1 cites·10 claims
- 0476US2025142988A1Backside-illumination solid-state image pickup apparatus, image pickup apparatus, and electronic equipment including embedment membersSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2024·Application pending·0 cites
- 0562US12255545B2Inverter device for capable of performing overheating protection to switching elements when driving electric motor and control method thereofNIDEC ELESYS CORP·Filed 2022·Granted Mar 18, 2025·0 cites·2 claims
- 0660US12230662B2Backside-illumination solid-state image pickup apparatus, image pickup apparatus, and electronic equipment including embedment membersSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Feb 18, 2025·0 cites·32 claims
- 0755US2025364513A1Package, semiconductor device, and method for manufacturing packageSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Application pending·0 cites
- 0855US2025201639A1Semiconductor device, manufacturing method thereof, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Application pending·0 cites
- 0954US2025219037A1Package and method for manufacturing packageSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Application pending·0 cites
- 1053US12150322B2Imaging device and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Nov 19, 2024·0 cites·18 claims
- 1150US10534162B2Lens attached substrate, layered lens structure, manufacturing method thereof, and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Jan 14, 2020·0 cites·18 claims
- 1250US2023113565A1Light-emitting device and method for manufacturing sameSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Application pending·0 cites
- 1347US2024006448A1Imaging device, method of manufacturing imaging device, and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Application pending·0 cites
- 1443US11979312B2Network path selection for communication devicesNIPPON TELEGRAPH & TELEPHONE·Filed 2020·Granted May 7, 2024·0 cites·5 claims
- 1543US2021314278A1Communication system and communication methodNIPPON TELEGRAPH & TELEPHONE·Filed 2019·Application pending·0 cites
- 1642US2020357838A1Laminated lens structure, solid-state imaging element, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Application pending·0 cites
- 1740US2023030183A1Alarm communication device, communication system, alarm communication method, and alarm communication programNIPPON TELEGRAPH & TELEPHONE·Filed 2019·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hirotaka Yoshioka files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →