Inventor · disambiguated record
Youngkyu Lim
Also filed as: LIM YOUNGKYU
4 granted patents·1 citations·filing 2019–2023
59Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0174US12176308B2Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 0267US11756908B2Package substrate including a redistribution pad extending from a redistribution layer and including segmenting grooves along a redial direction thereof and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·20 claims
- 0362US11302661B2Package substrate including segment grooves arranged in a radial direction of a redistribution pad and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 12, 2022·0 cites·18 claims
- 0462US11264339B2Method of manufacturing connection structure of semiconductor chip and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 1, 2022·1 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →