Inventor · disambiguated record
Heng-Cheng Chu
Also filed as: CHU HENG-CHENG
12 granted patents·4 pending applications·23 citations·filing 2004–2020
85Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD11BENQ CORP1CHEN CHING-HUA1FANG HAO-JU1TSAI TSUNG-HSIEN1
Top patents by PatentIndex Score
16 records- 0187US8264070B2Package structure with ESD and EMI preventing functionsTSAI TSUNG-HSIEN·Filed 2010·Granted Sep 11, 2012·11 cites·11 claims
- 0284US8963299B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Feb 24, 2015·8 cites·22 claims
- 0367US10230152B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Mar 12, 2019·2 cites·8 claims
- 0465US10587041B2Electronic package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Mar 10, 2020·1 cites·27 claims
- 0561US11476572B2Method for fabricating electronic package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Oct 18, 2022·0 cites·23 claims
- 0657US8618655B2Carrier-free semiconductor packageCHEN CHING-HUA·Filed 2011·Granted Dec 31, 2013·1 cites·7 claims
- 0752US8962396B2Fabrication method of carrier-free semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Feb 24, 2015·0 cites·11 claims
- 0851US9627748B2Electronic componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Apr 18, 2017·0 cites·16 claims
- 0951US9337250B2Semiconductor package and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted May 10, 2016·0 cites·3 claims
- 1049US10199731B2Electronic componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Feb 5, 2019·0 cites·7 claims
- 1149US2007273680A1Method for adjusting visibility of a display and system thereofBENQ CORP·Filed 2007·Application pending·0 cites
- 1248US10587037B2Electronic package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Mar 10, 2020·0 cites·20 claims
- 1347US9997477B2Method of manufacturing semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Jun 12, 2018·0 cites·4 claims
- 1444US2004179540A1Universal multi-media gatewayFiled 2004·Application pending·0 cites
- 1542US2015123251A1Semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 1632US2012170162A1Semiconductor package and fabrication method thereofFANG HAO-JU·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →