Inventor · disambiguated record
Kunio Arai
Also filed as: ARAI KUNIO
41 granted patents·10 pending applications·1,277 citations·filing 1987–2022
98Inventor score
Files withHITACHI VIA MECHANICS LTD15HITACHI SEIKO KK14ARAI KUNIO4NISSAN CHEMICAL IND LTD3OFUNA ENTPR JAPAN CO LTD3
Top patents by PatentIndex Score
51 records- 0197US6849824B2Multibeam laser drilling apparatusHITACHI VIA MECHANICS LTD·Filed 2003·Granted Feb 1, 2005·100 cites·17 claims
- 0295US6479788B1Method and apparatus of making a hole in a printed circuit boardHITACHI VIA MECHANICS LTD·Filed 2000·Granted Nov 12, 2002·79 cites·3 claims
- 0395US4915550APressure foot of printed circuit board drilling apparatusHITACHI SEIKO KK·Filed 1988·Granted Apr 10, 1990·59 cites·11 claims
- 0493US6521866B1Laser beam machining and laser beam machineHITACHI VIA MECHANICS LTD·Filed 2000·Granted Feb 18, 2003·95 cites·2 claims
- 0592US5010232AMethod of and apparatus for perforating printed circuit boardHITACHI SEIKO KK·Filed 1990·Granted Apr 23, 1991·70 cites·14 claims
- 0691US5635154AProcess for producing fine metal oxide particlesNISSAN CHEMICAL IND LTD·Filed 1995·Granted Jun 3, 1997·72 cites·4 claims
- 0790US7531767B2Method and apparatus for laser perforating printed circuit boardHITACHI VIA MECHANICS LTD·Filed 2006·Granted May 12, 2009·17 cites·18 claims
- 0888US5888036ADrill bit and step feeding methodHITACHI SEIKO KK·Filed 1997·Granted Mar 30, 1999·60 cites·9 claims
- 0986US7666320B2Manufacturing method of printed wiring board as well as copper-clad laminate and treatment solutions used thereforHITACHI VIA MECHANICS LTD·Filed 2006·Granted Feb 23, 2010·11 cites·7 claims
- 1086US5315072APrinted wiring board having blind holesHITACHI SEIKO KK·Filed 1992·Granted May 24, 1994·61 cites·4 claims
- 1183US6921820B2Method for forming celluloseGENESIS RES INST INC·Filed 2002·Granted Jul 26, 2005·25 cites·8 claims
- 1283US5332341APressure foot of printed circuit board drilling apparatusHITACHI SEIKO KK·Filed 1992·Granted Jul 26, 1994·46 cites·1 claims
- 1382US5480630AProcess for producing fine metal oxide particlesNISSAN CHEMICAL IND LTD·Filed 1991·Granted Jan 2, 1996·32 cites·4 claims
- 1482US4872787AMethod of drilling printed circuit boardHITACHI SEIKO KK·Filed 1987·Granted Oct 10, 1989·33 cites·20 claims
- 1581US6531677B2Method and apparatus for drilling printed wiring boardsHITACHI VIA MECHANICS LTD·Filed 2001·Granted Mar 11, 2003·30 cites·10 claims
- 1681US5024562APressure foot for printed circuit board drilling machineHITACHI SEIKO KK·Filed 1990·Granted Jun 18, 1991·53 cites·15 claims
- 1780US5349084AProcess for recovering high-purity organic acidIDEMITSU PETROCHEMICAL CO·Filed 1991·Granted Sep 20, 1994·23 cites·19 claims
- 1879US8366903B2Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing methodHitachi Via Mechanics·Filed 2008·Granted Feb 5, 2013·10 cites·4 claims
- 1979US5087156APrinted circuit board boring machineHITACHI SEIKO KK·Filed 1990·Granted Feb 11, 1992·45 cites·11 claims
- 2079US5078558ALow mass spindle and Z-axis unitHITACHI SEIKO KK·Filed 1990·Granted Jan 7, 1992·38 cites·12 claims
- 2178US5433878AMethod for producing fine particles of barium ferriteNISSAN CHEMICAL IND LTD·Filed 1994·Granted Jul 18, 1995·34 cites·13 claims
- 2277US8075788B2Fabrication method of printed circuit board and printed circuit board machining apparatusARAI KUNIO·Filed 2007·Granted Dec 13, 2011·8 cites·14 claims
- 2377US7205501B2Laser machining method and laser machining apparatusHITACHI VIA MECHANICS LTD·Filed 2004·Granted Apr 17, 2007·19 cites·5 claims
- 2475US6092538AMethod for using high density compressed liquefied gases in cleaning applicationsSHUZURIFURESHER KAIHATSUKYODOK·Filed 1997·Granted Jul 25, 2000·55 cites·11 claims
- 2572US6331320B1Process for producing aromatic compounds by supercritical water treatmentSUNTORY LTD·Filed 1999·Granted Dec 18, 2001·14 cites·12 claims
- 2672US5199830APrinted circuit board presser device in drilling machineHITACHI SEIKO KK·Filed 1990·Granted Apr 6, 1993·33 cites·7 claims
- 2771US6043453AApparatus for laser processing with a mechanical cutterHITACHI VIA MECHANICS LTD·Filed 1998·Granted Mar 28, 2000·41 cites·7 claims
- 2871US5108236ALow mass spindle and z-axis unitHITACHI SEIKO KK·Filed 1990·Granted Apr 28, 1992·29 cites·12 claims
- 2968US7335296B2System and device for processing supercritical and subcritical fluidTOHOKU TECHNO ARCH CO LTD·Filed 2002·Granted Feb 26, 2008·8 cites·18 claims
- 3067US6818053B2Process for producing quinacridone pigment microcrystalsJAPAN SCIENCE & TECH CORP·Filed 2001·Granted Nov 16, 2004·7 cites·5 claims
- 3167US6458407B1Process for producing essential oil by subcritical or supercritical water treatmentSUNTORY LTD·Filed 1999·Granted Oct 1, 2002·20 cites·11 claims
- 3265US6464797B1Method of separating electrophotographic carrier compositions and recycling the compositionsRICOH KK·Filed 2000·Granted Oct 15, 2002·9 cites·24 claims
- 3364US5066171AMethod for drilling a printed circuit boardHITACHI SEIKO KK·Filed 1989·Granted Nov 19, 1991·15 cites·10 claims
- 3463US7923659B2Laser machining method and laser machining apparatusHITACHI VIA MECHANICS LTD·Filed 2007·Granted Apr 12, 2011·1 cites·3 claims
- 3557US7182861B2System for separating electrophotographic carrier compositions and recycling the compositionsRICOH KK·Filed 2002·Granted Feb 27, 2007·3 cites·24 claims
- 3655US2008230512A1Printed Circuit Board and Method for Processing Printed Circuit BoardHITACHI VIA MECHANICS LTD·Filed 2008·Application pending·0 cites
- 3754US11576265B2Manufacturing method for printed circuit board and laser processing machineOFUNA ENTPR JAPAN CO LTD·Filed 2019·Granted Feb 7, 2023·0 cites·2 claims
- 3852US8278594B2Method and apparatus for perforating printed circuit boardARAI KUNIO·Filed 2009·Granted Oct 2, 2012·0 cites·1 claims
- 3951US4997319AApparatus for drilling a hole in a printed circuit boardHITACHI SEIKO KK·Filed 1989·Granted Mar 5, 1991·10 cites·7 claims
- 4051US2022288720A1Laser processing method and laser processing machineOFUNA ENTPR JAPAN CO LTD·Filed 2022·Application pending·0 cites
- 4150US2005244621A1Printed circuit board and method for processing printed circuit boardHITACHI VIA MECHANICS LTD·Filed 2005·Application pending·0 cites
- 4249US2011036493A1Surface treatment method for copper and surface treatment method for printed wiring boardKAWAMURA TOSHINORI·Filed 2009·Application pending·0 cites
- 4349US2008008854A1Composite sheet, machining method for composite sheet and laser machining apparatusHITACHI VIA MECHANICS LTD·Filed 2007·Application pending·0 cites
- 4448US8319147B2Laser machining method and laser machining apparatusARAI KUNIO·Filed 2006·Granted Nov 27, 2012·0 cites·8 claims
- 4545US2006076323A1Method and apparatus for laser drillingHITACHI VIA MECHANICS LTD·Filed 2005·Application pending·0 cites
- 4642US2004217093A1Method and apparatus for laser drillingHITACHI VIA MECHANICS LTD·Filed 2004·Application pending·0 cites
- 4741US5756378AMethod of and apparatus for laser processingHITACHI SEIKO KK·Filed 1996·Granted May 26, 1998·9 cites·15 claims
- 4839US2022216665A1Laser processing method of printed circuit board and laser processing machine for printed circuit boardOFUNA ENTPR JAPAN CO LTD·Filed 2021·Application pending·0 cites
- 4935US6258940B1Method for producing erythroseAJINOMOTO KK·Filed 1997·Granted Jul 10, 2001·3 cites·16 claims
- 5035US2012031147A1Method and Apparatus for Machining Thin-Film Layer of WorkpieceARAI KUNIO·Filed 2010·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →