Inventor · disambiguated record
Se-Jang Oh
Also filed as: OH SE-JANG
11 granted patents·3 pending applications·60 citations·filing 2000–2014
88Inventor score
Top patents by PatentIndex Score
14 records- 0182US7880490B2Wireless interface probe card for high speed one-shot wafer test and semiconductor testing apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 1, 2011·8 cites·20 claims
- 0279US8026733B2Interface structure of wafer test equipmentSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Sep 27, 2011·10 cites·12 claims
- 0374US7884628B2Interposer and probe card having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 8, 2011·4 cites·20 claims
- 0467US7973550B2Semiconductor device test apparatus including interface unit and method of testing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jul 5, 2011·3 cites·13 claims
- 0563US6625766B1Tester of semiconductor memory device and test method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Sep 23, 2003·14 cites·15 claims
- 0661US6445172B1Wafer probing system and method of calibrating wafer probing needle using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Sep 3, 2002·9 cites·16 claims
- 0759US8674718B2Built off testing apparatusOH SE-JANG·Filed 2010·Granted Mar 18, 2014·2 cites·9 claims
- 0858US6507801B1Semiconductor device testing systemSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jan 14, 2003·6 cites·20 claims
- 0956US8606102B2Test interface device, test system and optical interface memory deviceLEE SANG-HOON·Filed 2009·Granted Dec 10, 2013·4 cites·12 claims
- 1047US2014139258A1Built off testing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 1146US7538566B2Electrical test system including coaxial cablesSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 26, 2009·0 cites·13 claims
- 1245US2010025682A1Interface device for wireless testing, semiconductor device and semiconductor package including the same, and method for wirelessly testing using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1344US2009189624A1Interposer and a probe card assembly for electrical die sorting and methods of operating and manufacturing the sameAJOU UNIV IND ACAD COOP FOUND·Filed 2008·Application pending·0 cites
- 1440US8139949B2Electrical signal transmission module, method of transmitting electric signals and electrical inspection apparatus having the sameLEE SANG-HOON·Filed 2008·Granted Mar 20, 2012·0 cites·13 claims
Join the waitlist — get patent alerts
Get an alert when Se-Jang Oh files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →