Inventor · disambiguated record
So Hyun Jung
Also filed as: JUNG SO HYUN
5 granted patents·2 citations·filing 2012–2021
64Inventor score
Top patents by PatentIndex Score
5 records- 0166US10950512B2Semiconductor packages including a semiconductor chip and methods of forming the semiconductor packagesSK HYNIX INC·Filed 2018·Granted Mar 16, 2021·1 cites·10 claims
- 0263US10879160B2Semiconductor package with packaging substrateSK HYNIX INC·Filed 2018·Granted Dec 29, 2020·1 cites·19 claims
- 0360US11557523B2Semiconductor packages and methods of forming the semiconductor packagesSK HYNIX INC·Filed 2021·Granted Jan 17, 2023·0 cites·11 claims
- 0434US8907490B2Semiconductor packages having the first and second chip inclined sidewalls contact with each otherJUNG SO HYUN·Filed 2012·Granted Dec 9, 2014·0 cites·12 claims
- 0525US9536861B2Semiconductor package including a plurality of stacked chipsSK HYNIX INC·Filed 2015·Granted Jan 3, 2017·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →