Inventor · disambiguated record
Zi Song Poh
Also filed as: POH ZI SONG
6 granted patents·2 pending applications·9 citations·filing 2010–2018
72Inventor score
Top patents by PatentIndex Score
8 records- 0179US9209147B1Method of forming pillar bumpFOONG CHEE SENG·Filed 2014·Granted Dec 8, 2015·6 cites·13 claims
- 0266US10654709B1Shielded semiconductor device and lead frame thereforNXP USA INC·Filed 2018·Granted May 19, 2020·1 cites·20 claims
- 0356US9209144B1Substrate with electrically isolated bond padsNGION LEE FEE·Filed 2014·Granted Dec 8, 2015·2 cites·8 claims
- 0442US2015311143A1Lead frames having metal traces with metal stubsFOONG CHEE SENG·Filed 2014·Application pending·0 cites
- 0539US9165904B1Insulated wire bonding with EFO before second bondSIONG CHIN TECK·Filed 2014·Granted Oct 20, 2015·0 cites·14 claims
- 0634US9698093B2Universal BGA substrateFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jul 4, 2017·0 cites·9 claims
- 0731US2011204498A1Lead frame and semiconductor package manufactured therewithFREESCALE SEMICONDUCTOR INC·Filed 2010·Application pending·0 cites
- 0825US8450841B2Bonded wire semiconductor deviceONG LI TING CELINA·Filed 2011·Granted May 28, 2013·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →