Inventor · disambiguated record
Naoki Ohmiya
Also filed as: OHMIYA NAOKI
8 granted patents·3 pending applications·229 citations·filing 1998–2006
88Inventor score
Files withDISCO CORP9
Top patents by PatentIndex Score
11 records- 0195US7265033B2Laser beam processing method for a semiconductor waferDISCO CORP·Filed 2004·Granted Sep 4, 2007·138 cites·2 claims
- 0291US7179722B2Wafer dividing methodDISCO CORP·Filed 2005·Granted Feb 20, 2007·20 cites·5 claims
- 0386US7557904B2Wafer holding mechanismDISCO CORP·Filed 2006·Granted Jul 7, 2009·12 cites·5 claims
- 0484US7063083B2Wafer dividing method and apparatusDISCO CORP·Filed 2005·Granted Jun 20, 2006·8 cites·7 claims
- 0577US6726526B2Cutting machineDISCO CORP·Filed 2002·Granted Apr 27, 2004·22 cites·4 claims
- 0673US7449396B2Wafer dividing methodDISCO CORP·Filed 2005·Granted Nov 11, 2008·4 cites·3 claims
- 0765US7602071B2Apparatus for dividing an adhesive film mounted on a waferDISCO CORP·Filed 2005·Granted Oct 13, 2009·3 cites·4 claims
- 0861US6010396ABlade cover in a cutting apparatusDISCO CORP·Filed 1998·Granted Jan 4, 2000·22 cites·6 claims
- 0940US2006180136A1Tape expansion apparatusDISCO CORP·Filed 2005·Application pending·0 cites
- 1038US2004083868A1Cutting deviceFiled 2003·Application pending·0 cites
- 1132US2004099112A1Plate-like carrying mechanism and dicing device with carrying mechanismFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →