Inventor · disambiguated record
Yasunobu Oikawa
Also filed as: OIKAWA YASUNOBU
19 granted patents·6 pending applications·98 citations·filing 1982–2015
93Inventor score
Top patents by PatentIndex Score
25 records- 0188US8605410B2Thin-film capacitor and manufacturing method thereofOIKAWA YASUNOBU·Filed 2010·Granted Dec 10, 2013·9 cites·6 claims
- 0288US8498095B2Thin-film capacitor with internally hollow through holesYANO YOSHIHIKO·Filed 2010·Granted Jul 30, 2013·8 cites·2 claims
- 0387US9030800B2Thin film capacitorTDK CORP·Filed 2013·Granted May 12, 2015·6 cites·18 claims
- 0485US8997321B2Method of manufacturing a thin film capacitor having separated dielectric filmsTDK CORP·Filed 2012·Granted Apr 7, 2015·7 cites·2 claims
- 0583US9076600B2Thin film capacitorTDK CORP·Filed 2013·Granted Jul 7, 2015·4 cites·7 claims
- 0677US9564270B2Thin film capacitorTDK CORP·Filed 2014·Granted Feb 7, 2017·2 cites·14 claims
- 0772US4854936ASemiconductive ceramic composition and semiconductive ceramic capacitorTDK CORP·Filed 1988·Granted Aug 8, 1989·18 cites·9 claims
- 0870US8411411B2Thin-film capacitorOIKAWA YASUNOBU·Filed 2010·Granted Apr 2, 2013·2 cites·12 claims
- 0969US9711283B2Thin film capacitorTDK CORP·Filed 2015·Granted Jul 18, 2017·1 cites·3 claims
- 1069US8339766B2Method of manufacturing thin film capacitor and thin film capacitorYANO YOSHIHIKO·Filed 2010·Granted Dec 25, 2012·2 cites·3 claims
- 1168US9111681B2Thin film capacitorTDK CORP·Filed 2013·Granted Aug 18, 2015·2 cites·11 claims
- 1265US7132310B2Packaging substrate and manufacturing method thereof, integrated circuit device and manufacturing method thereof, and SAW deviceTDK CORP·Filed 2006·Granted Nov 7, 2006·2 cites·6 claims
- 1363US8435645B2Dielectric device and method of manufacturing dielectric deviceSHIBUE AKIRA·Filed 2010·Granted May 7, 2013·1 cites·8 claims
- 1459US4799127ASemiconductive ceramic composition and semiconductor ceramic capacitorTDK CORP·Filed 1987·Granted Jan 17, 1989·14 cites·15 claims
- 1554US8294036B2Electronic component and electronic component moduleKAKEI SHINICHIRO·Filed 2009·Granted Oct 23, 2012·1 cites·11 claims
- 1652US2013071555A1Method of manufacturing thin film capacitor and thin film capacitorTDK CORP·Filed 2012·Application pending·0 cites
- 1752US2013071554A1Method of manufacturing thin film capacitor and thin film capacitorTDK CORP·Filed 2012·Application pending·0 cites
- 1852US2013128410A1Method of manufacturing thin film capacitor and thin film capacitorTDK CORP·Filed 2012·Application pending·0 cites
- 1947US8149584B2Electronic component and electronic component moduleSAITA HITOSHI·Filed 2009·Granted Apr 3, 2012·0 cites·4 claims
- 2046US4404029ANon-linear polycrystalline barium titanate-type dielectric elementTDK ELECTRONICS CO LTD·Filed 1982·Granted Sep 13, 1983·10 cites·3 claims
- 2144US2006065439A1Wiring board and wiring board manufacturing methodTDK CORP·Filed 2005·Application pending·0 cites
- 2242US7015556B2Packaging substrate and manufacturing method thereof, integrated circuit device and manufacturing method thereof, and saw deviceTDK CORP·Filed 2004·Granted Mar 21, 2006·0 cites·4 claims
- 2342US4447549ANon-linear dielectric elementTDK CORP·Filed 1983·Granted May 8, 1984·9 cites·6 claims
- 2442US2010246091A1Thin film capacitor and method of manufacturing the sameTDK CORP·Filed 2010·Application pending·0 cites
- 2540US2003137039A1Packaging substrate and manufacturing method thereof, integrated circuit device and manufacturing method thereof, and saw deviceTDK CORP·Filed 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →