Inventor · disambiguated record
Shih-Long Wei
Also filed as: WEI SHIH-LONG
10 granted patents·9 pending applications·38 citations·filing 1992–2018
83Inventor score
Files withWEI SHIH-LONG11VIKING TECH CORP5IND TECH RES INST1INT TECHNOLOGY RESEARCH INST1WALSIN TECH CORPORATION1
Top patents by PatentIndex Score
19 records- 0165US8841172B2Method for forming package substrateWEI SHIH-LONG·Filed 2012·Granted Sep 23, 2014·2 cites·11 claims
- 0259US9373430B2Resistor componentVIKING TECH CORP·Filed 2013·Granted Jun 21, 2016·1 cites·7 claims
- 0358US8591756B2Method of manufacturing a metallized ceramic substrateWEI SHIH-LONG·Filed 2011·Granted Nov 26, 2013·1 cites·11 claims
- 0449US2014027051A1Method of Fabricating a Light Emitting Diode Packaging StructureVIKING TECH CORP·Filed 2013·Application pending·0 cites
- 0548US9204555B2Method of electroplating and depositing metalVIKING TECH CORP·Filed 2012·Granted Dec 1, 2015·0 cites·10 claims
- 0648US5250394AMetallization method for microwave circuitIND TECH RES INST·Filed 1992·Granted Oct 5, 1993·19 cites·17 claims
- 0747US2014170848A1Method of Forming SubstrateVIKING TECH CORP·Filed 2013·Application pending·0 cites
- 0844US2013082292A1Light Emitting Diode Packaging Structure and Method of Fabricating the SameWEI SHIH-LONG·Filed 2011·Application pending·0 cites
- 0943US2012211792A1Package Substrate and Method for Forming the SameWEI SHIH-LONG·Filed 2011·Application pending·0 cites
- 1042US2013089982A1Method of Fabricating a Substrate Having Conductive Through HolesWEI SHIH-LONG·Filed 2012·Application pending·0 cites
- 1141US2013313122A1Method For Fabricating Conductive Structures of SubstrateWEI SHIH-LONG·Filed 2012·Application pending·0 cites
- 1239US7640652B2Method of making a current sensing chip resistorVIKING TECH CORP·Filed 2007·Granted Jan 5, 2010·0 cites·1 claims
- 1339US2013098867A1Method for Selective Metallization on a Ceramic SubstrateWEI SHIH-LONG·Filed 2011·Application pending·0 cites
- 1438US9508474B2Method for manufacturing anticorrosive thin film resistor and structure thereofWEI SHIH-LONG·Filed 2015·Granted Nov 29, 2016·0 cites·7 claims
- 1538US5292624AMethod for forming a metallurgical interconnection layer package for a multilayer ceramic substrateINT TECHNOLOGY RESEARCH INST·Filed 1992·Granted Mar 8, 1994·15 cites·11 claims
- 1635US2012064230A1Method for forming conductive via in a substrateWEI SHIH-LONG·Filed 2010·Application pending·0 cites
- 1733US2012001212A1Light-Emitting Diode Packaging Structure and Substrate ThereforWEI SHIH-LONG·Filed 2010·Application pending·0 cites
- 1832US8590140B2Method for manufacturing alloy resistorWEI SHIH-LONG·Filed 2010·Granted Nov 26, 2013·0 cites·8 claims
- 1930US10864666B2Packaging device of electronic components and an encapsulation method thereofWALSIN TECH CORPORATION·Filed 2018·Granted Dec 15, 2020·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →