Inventor · disambiguated record
Jayne Mershon
Also filed as: MERSHON JAYNE L
9 granted patents·4 pending applications·88 citations·filing 2001–2008
88Inventor score
Top patents by PatentIndex Score
13 records- 0187US7630601B2Connecting a component with an embedded optical fiberINTEL CORP·Filed 2008·Granted Dec 8, 2009·12 cites·17 claims
- 0283US6509530B2Via intersect pad for electronic components and methods of manufactureINTEL CORP·Filed 2001·Granted Jan 21, 2003·24 cites·22 claims
- 0379US7361842B2Apparatus and method for an embedded air dielectric for a package and a printed circuit boardINTEL CORP·Filed 2005·Granted Apr 22, 2008·11 cites·15 claims
- 0479US7036217B2Methods of manufacturing via intersect pad for electronic componentsINTEL CORP·Filed 2003·Granted May 2, 2006·14 cites·27 claims
- 0573US7373068B2Connecting a component with an embedded optical fiberINTEL CORP·Filed 2006·Granted May 13, 2008·5 cites·11 claims
- 0664US7121841B2Electrical socket with compressible domed contactsINTEL CORP·Filed 2004·Granted Oct 17, 2006·12 cites·18 claims
- 0754US7334325B2Apparatus and method for improving coupling across plane discontinuities on circuit boardsINTEL CORP·Filed 2004·Granted Feb 26, 2008·5 cites·21 claims
- 0849US7234947B2Electrical socket with compressible domed contactsINTEL CORP·Filed 2006·Granted Jun 26, 2007·2 cites·23 claims
- 0948US7282647B2Apparatus for improving coupling across plane discontinuities on circuit boardsINTEL CORP·Filed 2002·Granted Oct 16, 2007·3 cites·16 claims
- 1043US2005063637A1Connecting a component with an embedded optical fiberFiled 2003·Application pending·0 cites
- 1142US2007037432A1Built up printed circuit boardsMERSHON JAYNE L·Filed 2005·Application pending·0 cites
- 1238US2005208749A1Methods for forming electrical connections and resulting devicesBECKMAN MICHAEL W·Filed 2004·Application pending·0 cites
- 1338US2005063638A1Optical fibers embedded in a printed circuit boardFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →