Inventor · disambiguated record
Ido Almog
Also filed as: ALMOG IDO
14 granted patents·6 pending applications·19 citations·filing 2015–2024
86Inventor score
Files withAPPLIED MATERIALS ISRAEL LTD20
Top patents by PatentIndex Score
20 records- 0193US11195267B1Multi-perspective wafer analysis using an acousto-optic deflectorAPPLIED MATERIALS ISRAEL LTD·Filed 2020·Granted Dec 7, 2021·4 cites·20 claims
- 0292US9535014B1Systems and methods for inspecting an objectAPPLIED MATERIALS ISRAEL LTD·Filed 2015·Granted Jan 3, 2017·8 cites·15 claims
- 0391US11035803B1Multi-perspective examination of a specimenAPPLIED MATERIALS ISRAEL LTD·Filed 2020·Granted Jun 15, 2021·3 cites·17 claims
- 0488US11662324B1Three-dimensional surface metrology of wafersAPPLIED MATERIALS ISRAEL LTD·Filed 2022·Granted May 30, 2023·2 cites·20 claims
- 0586US11250560B2Methods and systems for expediting multi-perspective wafer analysisAPPLIED MATERIALS ISRAEL LTD·Filed 2020·Granted Feb 15, 2022·2 cites·15 claims
- 0673US11859963B2Depth profiling of semiconductor structures using picosecond ultrasonicsAPPLIED MATERIALS ISRAEL LTD·Filed 2022·Granted Jan 2, 2024·0 cites·20 claims
- 0766US2025165663A1Methods and systems for obtaining a 3d profile of a sampleAPPLIED MATERIALS ISRAEL LTD·Filed 2024·Application pending·0 cites
- 0864US11519720B2Depth profiling of semiconductor structures using picosecond ultrasonicsAPPLIED MATERIALS ISRAEL LTD·Filed 2020·Granted Dec 6, 2022·0 cites·20 claims
- 0960US2025189435A1Acoustic resonance-based metrology of samplesAPPLIED MATERIALS ISRAEL LTD·Filed 2023·Application pending·0 cites
- 1060US2025116597A1Model-based acousto-optic depth-metrology of specimensAPPLIED MATERIALS ISRAEL LTD·Filed 2023·Application pending·0 cites
- 1159US12278085B2Hybrid scanning electron microscopy and acousto-optic based metrologyAPPLIED MATERIALS ISRAEL LTD·Filed 2022·Granted Apr 15, 2025·0 cites·20 claims
- 1259US2025155235A1Depth profiling of semiconductor structures using multi-wavelength pump-probe techniqueAPPLIED MATERIALS ISRAEL LTD·Filed 2023·Application pending·0 cites
- 1357US11713964B1Cathodoluminescence focal scans to characterize 3D NAND CH profileAPPLIED MATERIALS ISRAEL LTD·Filed 2022·Granted Aug 1, 2023·0 cites·20 claims
- 1455US2025391114A1Algorithm for 3d reconstruction of diagonally cut semiconductor logic structureAPPLIED MATERIALS ISRAEL LTD·Filed 2024·Application pending·0 cites
- 1553US11815470B2Multi-perspective wafer analysisAPPLIED MATERIALS ISRAEL LTD·Filed 2020·Granted Nov 14, 2023·0 cites·17 claims
- 1652US11803961B2Die-to-multi-die wafer inspectionAPPLIED MATERIALS ISRAEL LTD·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
- 1748US11688055B2Methods and systems for analysis of wafer scan dataAPPLIED MATERIALS ISRAEL LTD·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
- 1841US2020232934A1Multi-perspective wafer analysisAPPLIED MATERIALS ISRAEL LTD·Filed 2020·Application pending·0 cites
- 1940US10902582B2Computerized system and method for obtaining information about a region of an objectAPPLIED MATERIALS ISRAEL LTD·Filed 2019·Granted Jan 26, 2021·0 cites·18 claims
- 2039US9784689B2Method and system for inspecting an object with an array of beamsAPPLIED MATERIALS ISRAEL LTD·Filed 2015·Granted Oct 10, 2017·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →