Inventor · disambiguated record
Yuan-Pao Cheng
Also filed as: CHENG YUAN-PAO
2 granted patents·1 pending application·3 citations·filing 2008–2012
46Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0161US7928544B2Semiconductor chip package assembly with deflection- resistant leadfingersTEXAS INSTRUMENTS INC·Filed 2008·Granted Apr 19, 2011·3 cites·8 claims
- 0241US8274140B2Semiconductor chip package assembly with deflection-resistant leadfingersFENG CHIEN-TE·Filed 2011·Granted Sep 25, 2012·0 cites·4 claims
- 0340US2012276692A1Method for Assemblying a Semiconductor Chip Package with Deflection-Resistant LeadfingersFENG CHIEN-TE·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →