Inventor · disambiguated record
Kimihito Nishikawa
Also filed as: NISHIKAWA KIMIHITO
5 granted patents·3 pending applications·10 citations·filing 2012–2020
71Inventor score
Files withMITSUBISHI MATERIALS CORP8
Top patents by PatentIndex Score
8 records- 0184US10607915B2Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing deviceMITSUBISHI MATERIALS CORP·Filed 2015·Granted Mar 31, 2020·3 cites·18 claims
- 0277US9504144B2Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding pasteMITSUBISHI MATERIALS CORP·Filed 2013·Granted Nov 22, 2016·4 cites·8 claims
- 0367US9355986B2Solder joint structure, power module, power module substrate with heat sink and method of manufacturing the same, and paste for forming solder base layerMITSUBISHI MATERIALS CORP·Filed 2013·Granted May 31, 2016·2 cites·4 claims
- 0459US9579739B2Manufacturing method of power-module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Granted Feb 28, 2017·1 cites·4 claims
- 0558US2021068251A1Power module substrate, power module substrate with heat sink, power module, method of producing power module substrate, paste for copper sheet bonding, and method of producing bonded bodyMITSUBISHI MATERIALS CORP·Filed 2020·Application pending·0 cites
- 0649US2015313011A1Power module substrate, power module substrate with heat sink, power module, method of producing power module substrate, paste for copper sheet bonding, and method of producing bonded bodyMITSUBISHI MATERIALS CORP·Filed 2013·Application pending·0 cites
- 0748US10375825B2Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding pasteMITSUBISHI MATERIALS CORP·Filed 2016·Granted Aug 6, 2019·0 cites·7 claims
- 0840US2014318831A1Power module substrate, power module substrate with heat sink, power module, paste for forming flux component intrusion-preventing layer and method for bonding bonded bodyMITSUBISHI MATERIALS CORP·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →