Inventor · disambiguated record
Sotaro Oi
Also filed as: OI SOTARO
19 granted patents·3 pending applications·28 citations·filing 2008–2023
90Inventor score
Top patents by PatentIndex Score
22 records- 0184US10607915B2Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing deviceMITSUBISHI MATERIALS CORP·Filed 2015·Granted Mar 31, 2020·3 cites·18 claims
- 0282US10211068B2Power-module substrate with cooler and method of producing the sameMITSUBISHI MATERIALS CORP·Filed 2015·Granted Feb 19, 2019·4 cites·5 claims
- 0381US9615442B2Power module substrate and power moduleMITSUBISHI MATERIALS CORP·Filed 2013·Granted Apr 4, 2017·5 cites·18 claims
- 0478US11476127B2Manufacturing method of electronic-component-mounted moduleMITSUBISHI MATERIALS CORP·Filed 2018·Granted Oct 18, 2022·3 cites·12 claims
- 0575US10032648B2Method of manufacturing power-module substrate with heat-sinkMITSUBISHI MATERIALS CORP·Filed 2014·Granted Jul 24, 2018·4 cites·3 claims
- 0671US11302602B2Power-module substrate with heat-sinkMITSUBISHI MATERIALS CORP·Filed 2018·Granted Apr 12, 2022·2 cites·6 claims
- 0763US10453772B2Heat-sink-attached power-module substrate and power moduleMITSUBISHI MATERIALS CORP·Filed 2016·Granted Oct 22, 2019·1 cites·20 claims
- 0862US9897380B2Carrier transport systemTOYOTA MOTOR CO LTD·Filed 2013·Granted Feb 20, 2018·0 cites·11 claims
- 0961US9837363B2Power-module substrate unit and power moduleMITSUBISHI MATERIALS CORP·Filed 2015·Granted Dec 5, 2017·1 cites·9 claims
- 1060US10068829B2Power-module substrate unit and power moduleMITSUBISHI MATERIALS CORP·Filed 2015·Granted Sep 4, 2018·1 cites·16 claims
- 1160US9103594B2Carrier positioning method and carrier transport systemMATSUURA MASANARI·Filed 2009·Granted Aug 11, 2015·0 cites·6 claims
- 1259US9579739B2Manufacturing method of power-module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Granted Feb 28, 2017·1 cites·4 claims
- 1357US8177050B2Cooling method of carrying section and carrierMATSUURA MASANARI·Filed 2008·Granted May 15, 2012·2 cites·4 claims
- 1456US2025391743A1Multilayer assembly, semiconductor device using same, and method for manufacturing sameMITSUBISHI MATERIALS CORP·Filed 2023·Application pending·0 cites
- 1553US9018534B2Method of manufacturing power module substrate and power module substrateOI SOTARO·Filed 2012·Granted Apr 28, 2015·1 cites·10 claims
- 1645US9725367B2Apparatus and method for producing (metal plate)-(ceramic board) laminated assembly, and apparatus and method for producing power-module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Granted Aug 8, 2017·0 cites·5 claims
- 1745US9033705B2Heating furnace and heating method employed by heating furnaceMATSUURA MASANARI·Filed 2008·Granted May 19, 2015·0 cites·12 claims
- 1841US11355415B2Heat sink-attached power module substrate board and power moduleMITSUBISHI MATERIALS CORP·Filed 2019·Granted Jun 7, 2022·0 cites·6 claims
- 1941US11315868B2Electronic-component-mounted module design to reduce linear expansion coefficient mismatchesMITSUBISHI MATERIALS CORP·Filed 2018·Granted Apr 26, 2022·0 cites·6 claims
- 2037US11462456B2Power-module substrate with heat-sinkMITSUBISHI MATERIALS CORP·Filed 2018·Granted Oct 4, 2022·0 cites·2 claims
- 2135US2019058101A1Thermoelectric conversion module and thermoelectric conversion deviceMITSUBISHI MATERIALS CORP·Filed 2016·Application pending·0 cites
- 2233US2017229320A1Producing method of power-module substrateMITSUBISHI MATERIALS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →