Inventor · disambiguated record
Bastian Marten Noller
Also filed as: NOLLER BASTIAN · NOLLER BASTIAN MARTEN
9 granted patents·9 pending applications·13 citations·filing 2011–2016
80Inventor score
Top patents by PatentIndex Score
18 records- 0182US11317628B2Microparticle compositions comprising saflufenacilBASF AGRO BV·Filed 2016·Granted May 3, 2022·2 cites·24 claims
- 0276US9524874B2Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon filmsVENKATARAMAN SHYAM SUNDAR·Filed 2011·Granted Dec 20, 2016·6 cites·17 claims
- 0375US9777192B2Chemical mechanical polishing (CMP) composition comprising a proteinBASF SE·Filed 2013·Granted Oct 3, 2017·3 cites·16 claims
- 0456US9443739B2Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing of elemental germanium and/or Si1-xGex material in the presence of a CMP composition comprising a specific organic compoundNOLLER BASTIAN MARTEN·Filed 2012·Granted Sep 13, 2016·2 cites·17 claims
- 0543US2018103634A1Attenuation of phytotoxicity of multisite fungicides by high-molecular-weight dispersantsBASF SE·Filed 2016·Application pending·0 cites
- 0641US9416298B2Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing (CMP) of III-V material in the presence of a CMP composition comprising a specific non-ionic surfactantBASF SE·Filed 2013·Granted Aug 16, 2016·0 cites·12 claims
- 0741US2016160083A1Cmp composition comprising abrasive particles containing ceriaBASF SE·Filed 2014·Application pending·0 cites
- 0838US10214663B2Chemical-mechanical polishing composition comprising organic/inorganic composite particlesBASF SE·Filed 2015·Granted Feb 26, 2019·0 cites·20 claims
- 0938US9263296B2Chemical mechanical polishing (CMP) composition comprising two types of corrosion inhibitorsNOLLER BASTIAN·Filed 2012·Granted Feb 16, 2016·0 cites·25 claims
- 1037US2015099361A1Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing (cmp) of iii-v material in the presence of a cmp composition comprising a compound containing an n-heterocycleBASF SE·Filed 2013·Application pending·0 cites
- 1135US10407594B2Chemical mechanical polishing (CMP) composition comprising a polymeric polyamineNOLLER BASTIAN MARTEN·Filed 2012·Granted Sep 10, 2019·0 cites·12 claims
- 1233US2017204236A1Method for coating plastics substratesBASF COATINGS GMBH·Filed 2015·Application pending·0 cites
- 1332US2017166778A1Chemical mechanical polishing (cmp) composition comprising a poly(aminoacid)BASF SE·Filed 2015·Application pending·0 cites
- 1432US2016013066A1Chemical mechanical polishing (cmp) compositionBASF SE·Filed 2014·Application pending·0 cites
- 1531US2013200039A1Aqueous polishing compositions containing n-substituted diazenium dioxides and/or n'-hydroxy-diazenium oxide saltsNOLLER BASTIAN·Filed 2011·Application pending·0 cites
- 1630US10227506B2Chemical mechanical polishing (CMP) composition for high effective polishing of substrates comprising germaniumBASF SE·Filed 2015·Granted Mar 12, 2019·0 cites·16 claims
- 1729US2014199841A1Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing of elemental germanium and/or si1-xgex material in the presence of a cmp composition having a ph value of 3.0 to 5.5GAO NING·Filed 2012·Application pending·0 cites
- 1828US2013217231A1Chemical mechanical polishing (cmp) compositionDRESCHER BETTINA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →