Inventor · disambiguated record
Mark Tiam Weng Lam
Also filed as: LAM MARK T · LAM MARK T W · LAM MARK TIAM WENG
6 granted patents·3 citations·filing 2012–2016
70Inventor score
Top patents by PatentIndex Score
6 records- 0159US9229446B2Production line quality processesLAM MARK T·Filed 2012·Granted Jan 5, 2016·2 cites·22 claims
- 0254US10605850B2Screening methodology to eliminate wire sweep in bond and assembly module packagingIBM·Filed 2016·Granted Mar 31, 2020·0 cites·20 claims
- 0354US9255867B2Wire-pull test location identification on a wire of a microelectronic packageIBM·Filed 2013·Granted Feb 9, 2016·1 cites·20 claims
- 0450US10168692B2Production line quality processesIBM·Filed 2015·Granted Jan 1, 2019·0 cites·18 claims
- 0549US9470740B2Screening methodology to eliminate wire sweep in bond and assembly module packagingIBM·Filed 2013·Granted Oct 18, 2016·0 cites·13 claims
- 0641US9551640B2Wire-pull test location identification on a wire of a microelectronic packageIBM·Filed 2015·Granted Jan 24, 2017·0 cites·13 claims
Join the waitlist — get patent alerts
Get an alert when Mark Tiam Weng Lam files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →