Inventor · disambiguated record
Stefan Kramp
Also filed as: KRAMP STEFAN
14 granted patents·3 pending applications·9 citations·filing 2008–2025
86Inventor score
Top patents by PatentIndex Score
17 records- 0182US12327727B2Chip with a silicon carbide substrateINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jun 10, 2025·0 cites·20 claims
- 0282US2025266259A1Chip with a silicon carbide substrate and an electrical contactINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0375US10236265B2Semiconductor chip and method for forming a chip padINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 19, 2019·4 cites·18 claims
- 0472US11798807B2Process for producing an electrical contact on a silicon carbide substrateINFINEON TECHNOLOGIES AG·Filed 2021·Granted Oct 24, 2023·0 cites·14 claims
- 0571US2024360343A1Reactive pressure-sensitive adhesive elementTESA SE·Filed 2024·Application pending·0 cites
- 0670US9786620B2Semiconductor device and a method for manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 10, 2017·2 cites·25 claims
- 0764US9905685B2Semiconductor device and trench field plate field effect transistor with a field dielectric including thermally grown and deposited portionsINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Feb 27, 2018·1 cites·22 claims
- 0863US8441804B2Semiconductor device and method of manufacturing a semiconductor deviceHAEBERLEN OLIVER·Filed 2008·Granted May 14, 2013·2 cites·23 claims
- 0962US11842938B2Semiconductor device and method for forming a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2021·Granted Dec 12, 2023·0 cites·18 claims
- 1062US11043383B2Electrical contact connection on silicon carbide substrateINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 22, 2021·0 cites·12 claims
- 1161US11926769B2Storage-stable, reactive, pressure-sensitive adhesive tapeTESA SE·Filed 2021·Granted Mar 12, 2024·0 cites·20 claims
- 1253US10018667B2Method for testing semiconductor diesINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jul 10, 2018·0 cites·13 claims
- 1351US11217500B2Semiconductor device and method for forming a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 4, 2022·0 cites·26 claims
- 1451US10636754B2Semiconductor chip and method for forming a chip padINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 28, 2020·0 cites·8 claims
- 1550US10418319B2Method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 17, 2019·0 cites·20 claims
- 1650US9435849B2Method for testing semiconductor dies and a test apparatusINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 6, 2016·0 cites·4 claims
- 1740US2009230519A1Semiconductor DeviceINFINEON TECHNOLOGIES AG·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →