Inventor · disambiguated record
Keisuke Kishimoto
Also filed as: KISHIMOTO KEISUKE
20 granted patents·7 pending applications·69 citations·filing 2008–2024
92Inventor score
Top patents by PatentIndex Score
27 records- 0192US8429820B2Method of manufacturing liquid discharge headKOYAMA SHUJI·Filed 2011·Granted Apr 30, 2013·11 cites·13 claims
- 0289US8091234B2Manufacturing method for liquid discharge head substrateIBE SATOSHI·Filed 2008·Granted Jan 10, 2012·11 cites·7 claims
- 0386US8858812B2Processing method for an ink jet head substrateCANON KK·Filed 2012·Granted Oct 14, 2014·4 cites·14 claims
- 0486US8177988B2Method for manufacturing liquid discharge headKOMIYAMA HIROTO·Filed 2008·Granted May 15, 2012·9 cites·13 claims
- 0584US8613862B2Method for manufacturing liquid discharge head substrateASAI KAZUHIRO·Filed 2008·Granted Dec 24, 2013·8 cites·15 claims
- 0684US8114305B2Method of manufacturing substrate for liquid discharge headKOMIYAMA HIROTO·Filed 2008·Granted Feb 14, 2012·8 cites·7 claims
- 0783US8287747B2Method of processing silicon substrate and method of manufacturing substrate for liquid discharge headKISHIMOTO KEISUKE·Filed 2010·Granted Oct 16, 2012·4 cites·6 claims
- 0877US10363696B2Process for production of embossed films based on plasticized polyvinyl acetalKURARAY EUROPE GMBH·Filed 2015·Granted Jul 30, 2019·2 cites·12 claims
- 0971US9333749B2Method for manufacturing liquid ejection head substrateCANON KK·Filed 2012·Granted May 10, 2016·3 cites·10 claims
- 1069US8492281B2Liquid composition, method of producing silicon substrate, and method of producing liquid discharge head substrateABO HIROYUKI·Filed 2012·Granted Jul 23, 2013·2 cites·4 claims
- 1165US8435805B2Method of manufacturing a substrate for liquid ejection headYONEMOTO TAICHI·Filed 2011·Granted May 7, 2013·1 cites·10 claims
- 1265US8197705B2Method of processing silicon substrate and method of manufacturing liquid discharge headKISHIMOTO KEISUKE·Filed 2008·Granted Jun 12, 2012·2 cites·13 claims
- 1365US8182072B2Substrate for inkjet printing head and method for manufacturing the substrateIBE SATOSHI·Filed 2008·Granted May 22, 2012·2 cites·6 claims
- 1464US8597529B2Method for processing substrate and method for producing liquid ejection head and substrate for liquid ejection headKISHIMOTO KEISUKE·Filed 2009·Granted Dec 3, 2013·2 cites·14 claims
- 1560US2025229528A1Liquid ejection head, liquid ejection apparatus, and method of manufacturing liquid ejection headCANON KK·Filed 2024·Application pending·0 cites
- 1658US10391772B2Silicon substrate processing method and liquid ejection head manufacturing methodCANON KK·Filed 2018·Granted Aug 27, 2019·0 cites·14 claims
- 1758US2025062672A1Power Conversion Device, Power Conversion Method and Non-Transitory Computer Readable Recording MediumDIAMOND & ZEBRA ELECTRIC MFG CO LTD·Filed 2024·Application pending·0 cites
- 1856US8549750B2Method of manufacturing liquid discharge head substrate and method of processing the substrateKATO MASATAKA·Filed 2009·Granted Oct 8, 2013·0 cites·6 claims
- 1951US8975097B2Method of manufacturing liquid discharge headCANON KK·Filed 2014·Granted Mar 10, 2015·0 cites·9 claims
- 2048US8993357B2Method for manufacturing liquid discharge headCANON KK·Filed 2014·Granted Mar 31, 2015·0 cites·11 claims
- 2145US2011183448A1Liquid composition, method of producing silicon substrate, and method of producing liquid discharge head substrateCANON KK·Filed 2011·Application pending·0 cites
- 2241US2018326723A1Liquid ejecting headCANON KK·Filed 2018·Application pending·0 cites
- 2339US2013316473A1Method of processing inkjet head substrateCANON KK·Filed 2013·Application pending·0 cites
- 2438US9669628B2Liquid ejection head substrate, method of manufacturing the same, and method of processing silicon substrateCANON KK·Filed 2015·Granted Jun 6, 2017·0 cites·2 claims
- 2536US8951815B2Method for producing liquid-discharge-head substrateMURAKAMI RYOTARO·Filed 2012·Granted Feb 10, 2015·0 cites·5 claims
- 2635US2016347064A1Liquid ejection head and method of processing silicon substrateCANON KK·Filed 2016·Application pending·0 cites
- 2735US2012088317A1Processing method of silicon substrate and process for producing liquid ejection headKISHIMOTO KEISUKE·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Keisuke Kishimoto files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →