Inventor · disambiguated record
Gi Jo Jung
Also filed as: JUNG GI JO
5 granted patents·3 pending applications·37 citations·filing 2008–2023
78Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0183US7808095B2Ultra slim semiconductor package and method of fabricating the sameNEPES CORP·Filed 2008·Granted Oct 5, 2010·17 cites·10 claims
- 0279US8237276B2Bump structure and fabrication method thereofSONG CHI JUNG·Filed 2010·Granted Aug 7, 2012·8 cites·6 claims
- 0374US8421211B2Wafer level semiconductor package and fabrication method thereofKANG IN SOO·Filed 2010·Granted Apr 16, 2013·6 cites·13 claims
- 0468US11276632B2Semiconductor packageNEPES CO LTD·Filed 2019·Granted Mar 15, 2022·2 cites·17 claims
- 0565US7952210B2Semiconductor package and fabrication method thereofNEPES CORP·Filed 2008·Granted May 31, 2011·4 cites·16 claims
- 0654US2024162128A1Methods of fabricating semiconductor packageLBSEMICON CO LTD·Filed 2023·Application pending·0 cites
- 0741US2009146281A1System in package and fabrication method thereofNEPES CORP·Filed 2008·Application pending·0 cites
- 0832US2012286419A1Semiconductor package with interposer block thereinKWON YONG TAE·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →