Inventor · disambiguated record
Tu-Anh N. Tran
Also filed as: TRAN TU-ANH · TRAN TU-ANH N
21 granted patents·5 pending applications·484 citations·filing 2002–2014
95Inventor score
Technology areasH10W
Files withFREESCALE SEMICONDUCTOR INC12TRAN TU-ANH N6CARPENTER BURTON J2SAFAI SOHRAB2JOHNSTON JAMES P1
Top patents by PatentIndex Score
26 records- 0196US9437459B2Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structureCARPENTER BURTON J·Filed 2014·Granted Sep 6, 2016·41 cites·13 claims
- 0295US6998952B2Inductive device including bond wiresFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Feb 14, 2006·137 cites·26 claims
- 0394US6844631B2Semiconductor device having a bond pad and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Jan 18, 2005·161 cites·11 claims
- 0492US7374971B2Semiconductor die edge reconditioningFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted May 20, 2008·28 cites·10 claims
- 0583US6937047B2Integrated circuit with test pad structure and method of testingFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Aug 30, 2005·36 cites·38 claims
- 0681US7808117B2Integrated circuit having pads and input/output (I/O) cellsFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Oct 5, 2010·12 cites·20 claims
- 0778US10325876B2Surface finish for wirebondingMATHEW VARUGHESE·Filed 2014·Granted Jun 18, 2019·4 cites·10 claims
- 0876US6921979B2Semiconductor device having a bond pad and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Jul 26, 2005·27 cites·33 claims
- 0975US9111755B1Bond pad and passivation layer having a gap and method for formingTRAN TU-ANH N·Filed 2014·Granted Aug 18, 2015·4 cites·20 claims
- 1072US9780051B2Methods for forming semiconductor devices with stepped bond padsTRAN TU-ANH N·Filed 2013·Granted Oct 3, 2017·3 cites·19 claims
- 1171US9437574B2Electronic component package and method for forming sameTRAN TU-ANH N·Filed 2013·Granted Sep 6, 2016·3 cites·18 claims
- 1270US7271013B2Semiconductor device having a bond pad and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Sep 18, 2007·17 cites·18 claims
- 1368US8129226B2Power lead-on-chip ball grid array packageJOHNSTON JAMES P·Filed 2007·Granted Mar 6, 2012·6 cites·17 claims
- 1464US8791582B2Integrated circuit package with voltage distributorLEE CHU-CHUNG·Filed 2010·Granted Jul 29, 2014·3 cites·17 claims
- 1553US9331046B2Integrated circuit package with voltage distributorFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted May 3, 2016·0 cites·20 claims
- 1649US9368470B2Coated bonding wire and methods for bonding using sameFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jun 14, 2016·0 cites·19 claims
- 1749US9324675B2Structures for reducing corrosion in wire bondsCARPENTER BURTON J·Filed 2014·Granted Apr 26, 2016·0 cites·10 claims
- 1845US7015585B2Packaged integrated circuit having wire bonds and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Mar 21, 2006·2 cites·8 claims
- 1944US2014367859A1Tin-based wirebond structuresFREESCALE SEMICONDUCTOR INC·Filed 2014·Application pending·0 cites
- 2043US9257403B2Copper ball bond interface structure and formationFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Feb 9, 2016·0 cites·20 claims
- 2142US8556159B2Embedded electronic componentTRAN TU-ANH N·Filed 2012·Granted Oct 15, 2013·0 cites·20 claims
- 2241US2015303169A1Systems and methods for multiple ball bond structuresTRAN TU-ANH N·Filed 2014·Application pending·0 cites
- 2340US2007087067A1Semiconductor die having a protective periphery region and method for formingYUAN YUAN·Filed 2005·Application pending·0 cites
- 2438US9515034B2Bond pad having a trench and method for formingSAFAI SOHRAB·Filed 2014·Granted Dec 6, 2016·0 cites·20 claims
- 2538US2007267748A1Integrated circuit having pads and input/output (i/o) cellsTRAN TU-ANH N·Filed 2006·Application pending·0 cites
- 2635US2015194395A1Bond pad having a trench and method for formingSAFAI SOHRAB·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →