Inventor · disambiguated record
Hideyuki Wada
Also filed as: WADA HIDEYUKI
11 granted patents·15 pending applications·30 citations·filing 1998–2025
84Inventor score
Top patents by PatentIndex Score
26 records- 0194US10295852B2Optical device and method for manufacturing optical deviceFUJIKURA LTD·Filed 2016·Granted May 21, 2019·17 cites·7 claims
- 0281US10139700B2Optical deviceFUJIKURA LTD·Filed 2016·Granted Nov 27, 2018·2 cites·4 claims
- 0364US9667843B2Imaging module, insulating-tube-attached imaging module, lens-attached imaging module, and endoscopeFUJIKURA LTD·Filed 2014·Granted May 30, 2017·1 cites·16 claims
- 0464US2025285074A1In-store guidance system and methodTOSHIBA TEC KK·Filed 2024·Application pending·0 cites
- 0562US11018441B2Wireless moduleFUJIKURA LTD·Filed 2018·Granted May 25, 2021·1 cites·2 claims
- 0660US2024233981A9Water-proof structure for electric wire and water-proof method for electric wireYAZAKI CORP·Filed 2023·Application pending·0 cites
- 0760US2024145125A1Water-stop structure of wire bundle and manufacturing method thereofYAZAKI CORP·Filed 2023·Application pending·0 cites
- 0860US2024145124A1Water-proof structure for electric wire and water-proof method for electric wireYAZAKI CORP·Filed 2023·Application pending·0 cites
- 0960US2024153672A1Water-stop structure of wire and manufacturing method thereofYAZAKI CORP·Filed 2023·Application pending·0 cites
- 1059US8564101B2Semiconductor apparatus having a through-hole interconnectionHARADA YOSHIMICHI·Filed 2009·Granted Oct 22, 2013·2 cites·2 claims
- 1156US2024280996A1Customer service robot and methodTOSHIBA TEC KK·Filed 2024·Application pending·0 cites
- 1255US11178750B2Multilayer substrate, multilayer substrate array, and transmission/ reception moduleFUJIKURA LTD·Filed 2018·Granted Nov 16, 2021·0 cites·9 claims
- 1351US2025285099A1Information processing device, information processing system, and information processing methodTOSHIBA TEC KK·Filed 2025·Application pending·0 cites
- 1450US12010452B2Endoscopic device, display image output method, computer-readable medium, and endoscopic systemOLYMPUS CORP·Filed 2022·Granted Jun 11, 2024·0 cites·20 claims
- 1550US10386665B2Optical element packageFUJIKURA LTD·Filed 2016·Granted Aug 20, 2019·0 cites·8 claims
- 1649US2024281823A1Customer service robot and methodTOSHIBA TEC KK·Filed 2024·Application pending·0 cites
- 1745US12035878B2Endoscope system for assiging multiple functions to a switch, control method of endoscope system and storage mediumOLYMPUS CORP·Filed 2020·Granted Jul 16, 2024·0 cites·17 claims
- 1844US2011290545A1Through wiring board and method of manufacturing the sameWADA HIDEYUKI·Filed 2011·Application pending·0 cites
- 1942US8273657B2Method for manufacturing a semiconductor apparatus having a through-hole interconnectionHARADA YOSHIMICHI·Filed 2011·Granted Sep 25, 2012·0 cites·4 claims
- 2039US2007176294A1Thorough wiring board and method of manufacturing the sameFUJIKURA LTD·Filed 2004·Application pending·0 cites
- 2138US2004233563A1Recording apparatusFiled 2003·Application pending·0 cites
- 2237US2020153114A1Planar array antenna and wireless moduleFUJIKURA LTD·Filed 2018·Application pending·0 cites
- 2336US2018040525A1Electronic component-mounted body and method for manufacturing sameFUJIKURA LTD·Filed 2017·Application pending·0 cites
- 2436US2011133343A1Semiconductor deviceFUJIKURA LTD·Filed 2011·Application pending·0 cites
- 2536US2018184881A1Endoscope processorOLYMPUS CORP·Filed 2018·Application pending·0 cites
- 2632US6361841B1Oil well pipeNIPPON KOKAN KK·Filed 1998·Granted Mar 26, 2002·7 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Hideyuki Wada files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →