Inventor · disambiguated record
Hiroyuki Miyazawa
Also filed as: MIYAZAWA HIROYUKI
24 granted patents·2 pending applications·632 citations·filing 1985–2019
97Inventor score
Top patents by PatentIndex Score
26 records- 0190US5734188ASemiconductor integrated circuit, method of fabricating the same and apparatus for fabricating the sameHITACHI LTD·Filed 1996·Granted Mar 31, 1998·73 cites·13 claims
- 0290US5237187ASemiconductor memory circuit device and method for fabricating sameHITACHI LTD·Filed 1991·Granted Aug 17, 1993·66 cites·10 claims
- 0384US5045904ASemiconductor device including an improved trench arrangementKOBAYASHI YUTAKA·Filed 1988·Granted Sep 3, 1991·46 cites·7 claims
- 0483US6043118ASemiconductor memory circuit device and method for fabricating a semiconductor memory device circuitHITACHI LTD·Filed 1997·Granted Mar 28, 2000·43 cites·21 claims
- 0579US5389558AMethod of making a semiconductor memory circuit deviceHITACHI LTD·Filed 1993·Granted Feb 14, 1995·35 cites·20 claims
- 0675US6280522B1Quartz glass crucible for pulling silicon single crystal and production process for such crucibleSHINETSU QUARTZ PROD·Filed 1999·Granted Aug 28, 2001·23 cites·19 claims
- 0773US5917211ASemiconductor integrated circuit, method of fabricating the same and apparatus for fabricating the sameHITACHI LTD·Filed 1997·Granted Jun 29, 1999·37 cites·11 claims
- 0873US4962052AMethod for producing semiconductor integrated circuit deviceHITACHI LTD·Filed 1990·Granted Oct 9, 1990·37 cites·17 claims
- 0970US5576884ABase body of reflecting mirror and method for preparing the sameSHIN ETSU QUARTZ CO LTD·Filed 1995·Granted Nov 19, 1996·33 cites·1 claims
- 1069US5651827ASingle-wafer heat-treatment apparatus and method of manufacturing reactor vessel used for sameHERAEUS QUARZGLAS·Filed 1996·Granted Jul 29, 1997·36 cites·11 claims
- 1169US5268587ASemiconductor integrated circuit device including a dielectric breakdown prevention circuitHITACHI LTD·Filed 1991·Granted Dec 7, 1993·29 cites·23 claims
- 1267US6991150B2Method of build up welding to thin-walled portionISHIKAWAJIMA INSPECTION & INST·Filed 2003·Granted Jan 31, 2006·10 cites·8 claims
- 1365US5264712ASemiconductor integrated circuit, method of fabricating the same and apparatus for fabricating the sameHITACHI LTD·Filed 1992·Granted Nov 23, 1993·27 cites·10 claims
- 1461US5640282ABase body of reflecting mirror and method for preparing the sameSHIN ETSU QUARTZ CO LTD·Filed 1991·Granted Jun 17, 1997·18 cites·2 claims
- 1561US5631182AMethod of making a semiconductor memory circuit deviceHITACHI LTD·Filed 1994·Granted May 20, 1997·15 cites·6 claims
- 1660US8479385B2Method of producing wiring substrateMIYAZAWA HIROYUKI·Filed 2011·Granted Jul 9, 2013·2 cites·11 claims
- 1758US2009152119A1Method for manufacturing magnetic headFUJITSU LTD·Filed 2008·Application pending·0 cites
- 1856US5081515ASemiconductor integrated circuit deviceHITACHI LTD·Filed 1990·Granted Jan 14, 1992·25 cites·30 claims
- 1954US6511365B2Lapping machineFUJITSU LTD·Filed 1999·Granted Jan 28, 2003·10 cites·19 claims
- 2053US2009283205A1Method of manufacturing a thin-film magnetic headFUJITSU LTD·Filed 2009·Application pending·0 cites
- 2152US5968259AHigh-purity quartz glass and method for the preparation thereofSHINETSU QUARTZ PROD·Filed 1997·Granted Oct 19, 1999·17 cites·3 claims
- 2252US4921815AMethod of producing a semiconductor memory device having trench capacitorsHITACHI LTD·Filed 1988·Granted May 1, 1990·12 cites·17 claims
- 2350US5617262ABase body of reflecting mirror and method for preparing the sameSHIN ETSU QUARTZ CO LTD·Filed 1995·Granted Apr 1, 1997·12 cites·12 claims
- 2446US4612565ASemiconductor memory deviceHITACHI LTD·Filed 1985·Granted Sep 16, 1986·14 cites·15 claims
- 2544US5877027AMethod for the analysis of impurity contents in silicon dioxideSHINETSU QUARTZ PROD·Filed 1997·Granted Mar 2, 1999·12 cites·15 claims
- 2638US11895946B2Reciprocating mower unit, system and methodsHUSQVARNA AB·Filed 2019·Granted Feb 13, 2024·0 cites·16 claims
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