Inventor · disambiguated record
Manu Jamnadas Tejwani
Also filed as: TEJWANI MANU J · TEJWANI MANU JAMNADAS
6 granted patents·271 citations·filing 1992–1997
88Inventor score
Files withIBM6
Top patents by PatentIndex Score
6 records- 0190US5897370AHigh aspect ratio low resistivity lines/vias by surface diffusionIBM·Filed 1996·Granted Apr 27, 1999·89 cites·2 claims
- 0284US6030895AMethod of making a soft metal conductorIBM·Filed 1997·Granted Feb 29, 2000·55 cites·27 claims
- 0384US5731245AHigh aspect ratio low resistivity lines/vias with a tungsten-germanium alloy hard capIBM·Filed 1996·Granted Mar 24, 1998·52 cites·3 claims
- 0470US6285082B1Soft metal conductorIBM·Filed 1995·Granted Sep 4, 2001·28 cites·20 claims
- 0562US5420069AMethod of making corrosion resistant, low resistivity copper for interconnect metal linesIBM·Filed 1992·Granted May 30, 1995·30 cites·2 claims
- 0660US5877084AMethod for fabricating high aspect ratio low resistivity lines/vias by surface reactionIBM·Filed 1997·Granted Mar 2, 1999·17 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →