Inventor · disambiguated record
Francesco Salamone
Also filed as: SALAMONE FRANCESCO
11 granted patents·10 pending applications·37 citations·filing 2013–2025
86Inventor score
Top patents by PatentIndex Score
21 records- 0195US11562950B2Packaged stackable electronic power device for surface mounting and circuit arrangementST MICROELECTRONICS SRL·Filed 2021·Granted Jan 24, 2023·4 cites·20 claims
- 0294US11894290B2Packaged stackable electronic power device for surface mounting and circuit arrangementST MICROELECTRONICS SRL·Filed 2023·Granted Feb 6, 2024·2 cites·21 claims
- 0392US10720373B2Semiconductor power device with corresponding package and related manufacturing processST MICROELECTRONICS SRL·Filed 2019·Granted Jul 21, 2020·8 cites·20 claims
- 0490US9986631B2Electronic power module with enhanced thermal dissipation and manufacturing method thereofST MICROELECTRONICS SRL·Filed 2016·Granted May 29, 2018·16 cites·20 claims
- 0581US11864361B2Packaged power electronic device, in particular bridge circuit comprising power transistors, and assembling process thereofST MICROELECTRONICS SRL·Filed 2020·Granted Jan 2, 2024·1 cites·20 claims
- 0680US9570380B2Electronic device provided with an encapsulation structure with improved electric accessibility and method of manufacturing the electronic deviceST MICROELECTRONICS SRL·Filed 2015·Granted Feb 14, 2017·4 cites·15 claims
- 0779US12295128B2Packaged power electronic device, in particular bridge circuit comprising power transistors, and assembling process thereofST MICROELECTRONICS SRL·Filed 2023·Granted May 6, 2025·0 cites·20 claims
- 0878US12230555B2Packaged stackable electronic power device for surface mounting and circuit arrangementST MICROELECTRONICS SRL·Filed 2023·Granted Feb 18, 2025·0 cites·19 claims
- 0977US2025227895A1Packaged power electronic device, in particular bridge circuit comprising power transistors, and assembling process thereofST MICROELECTRONICS SRL·Filed 2025·Application pending·0 cites
- 1076US10756002B2Packaged power device having improved heat dissipation capacity and better thermal performancesST MICROELECTRONICS SRL·Filed 2019·Granted Aug 25, 2020·2 cites·23 claims
- 1166US2024429132A1Blocking element for connecting pins of semiconductor diceST MICROELECTRONICS SRL·Filed 2024·Application pending·0 cites
- 1264US2025218921A1Thermally conductive support and assembly comprising a thermally conductive support and a packaged power deviceST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1362US11239132B2Semiconductor power device with corresponding package and related manufacturing processST MICROELECTRONICS SRL·Filed 2020·Granted Feb 1, 2022·0 cites·14 claims
- 1462US2025176113A1Rigid-flexible pcb, power module including the pcb, and manufacturing method of the power moduleST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1560US12094806B2Blocking element for connecting pins of semiconductor diceST MICROELECTRONICS SRL·Filed 2021·Granted Sep 17, 2024·0 cites·18 claims
- 1656US2023317685A1Packaged electronic device comprising a plurality of power transistorsST MICROELECTRONICS SRL·Filed 2023·Application pending·0 cites
- 1756US2025137863A1Test benches to check correct operation of torque wrenches fitted with devices for positioning reaction points of the torque wrenchesATLAS COPCO IND TECHNIQUE AB·Filed 2023·Application pending·0 cites
- 1855US2023317537A1Power module having leadframe-less signal connectors, in particular for automotive applications, and assembling method thereofST MICROELECTRONICS SRL·Filed 2023·Application pending·0 cites
- 1954US2025336896A1Packaged electronic device comprising circuits formed by a plurality of power devices coupled in source-to-source or drain-to-drain configurationST MICROELECTRONICS INT NV·Filed 2025·Application pending·0 cites
- 2040US2013285223A1Method for manufacturing electronic devicesST MICROELECTRONICS SRL·Filed 2013·Application pending·0 cites
- 2140US2013328180A1Packaged semiconductor device with an exposed metal top surfaceST MICROELECTRONICS SRL·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →