Inventor · disambiguated record
Cheng Zhe Huang
Also filed as: HUANG CHENG ZHE
6 granted patents·5 pending applications·1 citations·filing 2009–2014
65Inventor score
Top patents by PatentIndex Score
11 records- 0148US9517612B2Floor material using PLA resinHUANG CHENG-ZHE·Filed 2011·Granted Dec 13, 2016·1 cites·15 claims
- 0247US9475913B2Foam sheet using polylactic acid having extended chain and method for preparing the sameLG HAUSYS LTD·Filed 2012·Granted Oct 25, 2016·0 cites·15 claims
- 0347US2016068682A1Board comprising biodegradable resin and wooden flour and method of manufacturing the sameLG HAUSYS LTD·Filed 2014·Application pending·0 cites
- 0446US9512265B2Foam sheet using cross-linked polylactic acid, and preparation method thereofLG HAUSYS LTD·Filed 2012·Granted Dec 6, 2016·0 cites·10 claims
- 0545US2015080503A1Environmentally-friendly board using polylactic acid and wood fiber, and method for preparing sameLG HAUSYS LTD·Filed 2012·Application pending·0 cites
- 0645US2015051320A1Board using crosslinked polylactic acid and method for preparing sameLG HAUSYS LTD·Filed 2012·Application pending·0 cites
- 0740US2015073070A1Board using crosslinked polylactic acid and method for preparing sameLG HAUSYS LTD·Filed 2012·Application pending·0 cites
- 0838US9422729B2Chip-inlaid flooring material using PLA resinKWON HYUN-JONG·Filed 2011·Granted Aug 23, 2016·0 cites·15 claims
- 0935US9309628B2Wallpaper and method for manufacturing sameHUANG CHENG ZHE·Filed 2009·Granted Apr 12, 2016·0 cites·19 claims
- 1035US2013004703A1Board complex having pla coverLG HAUSYS LTD·Filed 2011·Application pending·0 cites
- 1133US9623635B2Chip through flooring material using PLA resinHUANG CHENG-ZHE·Filed 2011·Granted Apr 18, 2017·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →