Inventor · disambiguated record
Chung-Ki Min
Also filed as: MIN CHUNG-KI
14 granted patents·4 pending applications·52 citations·filing 2002–2022
90Inventor score
Top patents by PatentIndex Score
18 records- 0190US11637019B2Method for forming a semiconductor device having protrusion structures on a substrate and a planarized capping insulating layer on the protrusion structuresSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 25, 2023·2 cites·20 claims
- 0288US7156722B2Platen structure of polishing apparatus for processing semiconductor wafer and method for exchanging polishing pad affixed to the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 2, 2007·13 cites·20 claims
- 0387US10535679B2Semiconductor device including stack structures having R-type pad and P-type pad of different thicknessSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 14, 2020·4 cites·20 claims
- 0476US8133756B2Chemical-mechanical polishing method for polishing phase-change material and method of fabricating phase-change memory device using the samePARK JOON-SANG·Filed 2009·Granted Mar 13, 2012·8 cites·18 claims
- 0576US8039372B2Methods of manufacturing variable resistance non-volatile memory devices including a uniformly narrow contact layerSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 18, 2011·10 cites·9 claims
- 0676US7713879B2Chemical mechanical polishing methodSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 11, 2010·2 cites·24 claims
- 0770US8592315B2Chemical mechanical polishing methodKIM DONG-KEUN·Filed 2010·Granted Nov 26, 2013·2 cites·8 claims
- 0869US7589013B2Electrode structure and method of manufacturing the same, phase-change memory device having the electrode structure and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 15, 2009·4 cites·7 claims
- 0968US8975731B2Semiconductor device having an insulating layer structure and method of manufacturing the sameMIN CHUNG-KI·Filed 2013·Granted Mar 10, 2015·3 cites·12 claims
- 1064US7709319B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 4, 2010·2 cites·17 claims
- 1157US11145672B2Semiconductor device including stack structures having gate pads with different thicknessesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 12, 2021·0 cites·19 claims
- 1254US12341015B2Apparatus for polishing a wafer and method for fabricating a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 24, 2025·0 cites·11 claims
- 1354US11087990B2Semiconductor device with a stacked structure and a capping insulation layerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 10, 2021·0 cites·19 claims
- 1448US7025493B2Chemical supply system and chemical mixing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Apr 11, 2006·2 cites·19 claims
- 1547US2008042240A1Semiconductor device and method of manufacturing the sameJON YEOL·Filed 2007·Application pending·0 cites
- 1640US2008081460A1Method of manufaturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1739US2005022931A1Chemical mechanical polishing apparatusFiled 2004·Application pending·0 cites
- 1835US2005272348A1Polishing pad assembly, apparatus for polishing a wafer including the polishing pad assembly and method for polishing a wafer using the polishing pad assemblyMIN CHUNG-KI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →