Inventor · disambiguated record
Tsunehisa Kimura
Also filed as: KIMURA TSUNEHISA
12 granted patents·3 pending applications·171 citations·filing 2000–2013
90Inventor score
Files withPOLYMATECH CO LTD5JAPAN SOC PROMOTION MACH IND2SCHLUMBERGER TECHNOLOGY CORP2KAMATA MASAHIRO1KIMURA TSUNEHISA1
Top patents by PatentIndex Score
15 records- 0194US6649012B2Adhesion method and electronic componentPOLYMATECH CO LTD·Filed 2000·Granted Nov 18, 2003·98 cites·5 claims
- 0284US7758932B2Liquid crystal display device and display apparatusRICOH KK·Filed 2008·Granted Jul 20, 2010·8 cites·4 claims
- 0378US6902065B2Method for separation of plastic mixtures based on magneto-archimedes levitationJAPAN SOC PROMOTION MACH IND·Filed 2001·Granted Jun 7, 2005·23 cites·2 claims
- 0470US8553492B2Seismic source controller and display systemSCHLUMBERGER TECHNOLOGY CORP·Filed 2012·Granted Oct 8, 2013·2 cites·20 claims
- 0569US7291381B2Thermally conductive formed article and method of manufacturing the samePOLYMATECH CO LTD·Filed 2003·Granted Nov 6, 2007·10 cites·16 claims
- 0666US7008572B2Method of producing polymer spherical bodiesJAPAN SOC PROMOTION MACH IND·Filed 2002·Granted Mar 7, 2006·11 cites·24 claims
- 0763US6761842B2Heat conductive mold and manufacturing method thereofPOLYMATECH CO LTD·Filed 2003·Granted Jul 13, 2004·10 cites·17 claims
- 0860US8526269B2Methods and systems for deploying seismic devicesKAMATA MASAHIRO·Filed 2009·Granted Sep 3, 2013·5 cites·20 claims
- 0953US9036449B2Methods and systems for deploying seismic devicesSCHLUMBERGER TECHNOLOGY CORP·Filed 2013·Granted May 19, 2015·0 cites·15 claims
- 1052US7347955B2Heat conducting polymer mold productsPOLYMATECH CO LTD·Filed 2003·Granted Mar 25, 2008·1 cites·12 claims
- 1150US6918983B2Adhesion method and electronic componentPOLYMATECH CO LTD·Filed 2003·Granted Jul 19, 2005·3 cites·8 claims
- 1242US9500603B2Microcrystal structure analysis device, microcrystal structure analysis method, and X-ray shield deviceUNIV KYOTO·Filed 2013·Granted Nov 22, 2016·0 cites·16 claims
- 1342US2013309488A1Resin molded body and method of manufacturing sameSUZUKI MOTOR CORP·Filed 2013·Application pending·0 cites
- 1435US2001004546A1Heat conductive mold and manufacturing method thereofFiled 2000·Application pending·0 cites
- 1535US2006083109A1Seismic source controller and display systemKIMURA TSUNEHISA·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →