Inventor · disambiguated record
Hiroshi Soyama
Also filed as: SOYAMA HIROSHI
10 granted patents·2 pending applications·77 citations·filing 1983–2020
87Inventor score
Top patents by PatentIndex Score
12 records- 0192US10927031B2Method for dividing brittle-material substrateMITSUBOSHI DIAMOND IND CO LTD·Filed 2015·Granted Feb 23, 2021·4 cites·19 claims
- 0289US6629484B2Cutter wheel for brittle sheetsMITSUBOSHI DIAMOND IND CO LTD·Filed 2001·Granted Oct 7, 2003·43 cites·17 claims
- 0379US7762171B2Tip holderMITSUBOSHI DIAMOND IND CO LTD·Filed 2007·Granted Jul 27, 2010·3 cites·7 claims
- 0472US7814819B2Tip holderMITSUBOSHI DIAMOND IND CO LTD·Filed 2010·Granted Oct 19, 2010·3 cites·1 claims
- 0568US7851241B2Method for severing brittle material substrate and severing apparatus using the methodMITSUBOSHI DIAMOND IND CO LTD·Filed 2003·Granted Dec 14, 2010·5 cites·57 claims
- 0666US7234383B2Chip holderMITSUBOSHI DIAMOND IND CO LTD·Filed 2001·Granted Jun 26, 2007·9 cites·12 claims
- 0763USD285285SGlass cutterMITSUBOSHI DIAMOND KOGYO KK·Filed 1983·Granted Aug 26, 1986·10 cites·1 claims
- 0862US2020189957A1Method for dividing brittle-material substrateMITSUBOSHI DIAMOND IND CO LTD·Filed 2020·Application pending·0 cites
- 0946US10351461B2Method for dividing brittle substrateMITSUBOSHI DIAMOND IND CO LTD·Filed 2015·Granted Jul 16, 2019·0 cites·7 claims
- 1046US8881633B2Cutter wheel, manufacturing method for same, manual scribing tool and scribing deviceWAKAYAMA HARUO·Filed 2005·Granted Nov 11, 2014·0 cites·14 claims
- 1143US2004123717A1Cutter wheel, device and method using the cutter wheel, method of dividing laminated substrate, and method and device for manufacturing cutter wheelFiled 2002·Application pending·0 cites
- 1237US8707842B2Cutter wheel, manufacturing method for same, manual scribing tool and scribing deviceWAKAYAMA HARUO·Filed 2011·Granted Apr 29, 2014·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →