Inventor · disambiguated record
Bernard Malouin
Also filed as: MALOUIN BERNARD · MALOUIN JR BERNARD A
20 granted patents·6 pending applications·159 citations·filing 2011–2024
94Inventor score
Top patents by PatentIndex Score
26 records- 0198US11594470B2Modular microjet cooling of packaged electronic componentsMASSACHUSETTS INST TECHNOLOGY·Filed 2021·Granted Feb 28, 2023·10 cites·8 claims
- 0298US11322426B2Thermal management of RF devices using embedded microjet arraysMASSACHUSETTS INST TECHNOLOGY·Filed 2020·Granted May 3, 2022·13 cites·11 claims
- 0398US11018077B2Modular microjet cooling of packaged electronic componentsMASSACHUSETTS INST TECHNOLOGY·Filed 2020·Granted May 25, 2021·13 cites·7 claims
- 0498US10651112B2Thermal management of RF devices using embedded microjet arraysMASSACHUSETTS INST TECHNOLOGY·Filed 2017·Granted May 12, 2020·21 cites·29 claims
- 0597US10903141B2Thermal management of RF devices using embedded microjet arraysMASSACHUSETTS INST TECHNOLOGY·Filed 2019·Granted Jan 26, 2021·19 cites·19 claims
- 0696US11277937B2Re-entrant flow cold plateJETCOOL TECH INC·Filed 2020·Granted Mar 15, 2022·10 cites·19 claims
- 0796US11191184B2Direct contact fluid based cooling moduleJETCOOL TECH INC·Filed 2020·Granted Nov 30, 2021·11 cites·24 claims
- 0896US10665529B2Modular microjet cooling of packaged electronic componentsMASSACHUSETTS INST TECHNOLOGY·Filed 2018·Granted May 26, 2020·19 cites·17 claims
- 0996US10512152B2Device array backframe with integral manifolding for high performance fluid coolingMASSACHUSETTS INST TECHNOLOGY·Filed 2018·Granted Dec 17, 2019·21 cites·16 claims
- 1094US11844193B2Direct contact fluid based cooling moduleJETCOOL TECH INC·Filed 2021·Granted Dec 12, 2023·3 cites·24 claims
- 1193US12016157B2Actively cooled heat-dissipation lids for computer processors and assembliesJETCOOL TECH INC·Filed 2023·Granted Jun 18, 2024·2 cites·6 claims
- 1292US12289861B2Liquid-in-liquid cooling system for electronic componentsJETCOOL TECH INC·Filed 2022·Granted Apr 29, 2025·2 cites·24 claims
- 1391US12048118B2Flow-through, hot-spot-targeting immersion cooling assemblyJETCOOL TECH INC·Filed 2022·Granted Jul 23, 2024·2 cites·20 claims
- 1485US8564884B2Reconfigurable, non-oscillating liquid lens and imaging systemsHIRSA AMIR H·Filed 2011·Granted Oct 22, 2013·6 cites·24 claims
- 1581US11963341B2High temperature electronic device thermal management systemJETCOOL TECH INC·Filed 2021·Granted Apr 16, 2024·1 cites·22 claims
- 1678US12324126B2Actively cooled heat-dissipation lids for computer processors and processor assembliesJETCOOL TECH INC·Filed 2024·Granted Jun 3, 2025·0 cites·19 claims
- 1778US12100643B2Thermal management of electronics using co-located microjet nozzles and electronic elementsJETCOOL TECH INC·Filed 2020·Granted Sep 24, 2024·1 cites·10 claims
- 1876US8729515B2Pinned contact, oscillating liquid-liquid lens and imaging systemsHIRSA AMIR H·Filed 2011·Granted May 20, 2014·5 cites·25 claims
- 1975US2025056759A1Direct Contact Fluid Based Cooling ModuleJETCOOL TECH INC·Filed 2024·Application pending·0 cites
- 2067US2022408592A1Re-Entrant Flow Cold PlateJETCOOL TECH INC·Filed 2022·Application pending·0 cites
- 2161US12289871B2High temperature electronic device thermal management systemJETCOOL TECH INC·Filed 2023·Granted Apr 29, 2025·0 cites·21 claims
- 2253US2023284416A1Ship-and-Install Electronics Assembly with Multifunctional Interface Chassis and Liquid-Fluid Heat ExchangeJETCOOL TECH INC·Filed 2023·Application pending·0 cites
- 2347US2022117115A1Multi-Material, Variable Heat Flux Cold PlateJETCOOL TECH INC·Filed 2021·Application pending·0 cites
- 2444US2020350233A1Microjet-Cooled Flanges for Electronic DevicesJETCOOL TECH INC·Filed 2020·Application pending·0 cites
- 2543US12288733B2Conformal cooling assembly with substrate fluid-proofing for multi-die electronic assembliesJETCOOL TECH INC·Filed 2022·Granted Apr 29, 2025·0 cites·27 claims
- 2641US2020326025A1Fluid-Pressure Assisted Coaxial Fluid Elements, Fittings and AssembliesJETCOOL TECH INC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →