Inventor · disambiguated record
Edward J. Gordon
Also filed as: GORDON EDWARD J · GORDON EDWARD JACK
11 granted patents·3 pending applications·184 citations·filing 1990–2019
90Inventor score
Top patents by PatentIndex Score
14 records- 0189US6812193B2Slurry for mechanical polishing (CMP) of metals and use thereofIBM·Filed 2002·Granted Nov 2, 2004·53 cites·29 claims
- 0288US8169050B2BEOL wiring structures that include an on-chip inductor and an on-chip capacitor, and design structures for a radiofrequency integrated circuitDALEY DOUGLAS M·Filed 2008·Granted May 1, 2012·21 cites·27 claims
- 0382US7811919B2Methods of fabricating a BEOL wiring structure containing an on-chip inductor and an on-chip capacitorIBM·Filed 2008·Granted Oct 12, 2010·11 cites·25 claims
- 0482US5800183ASealed socket assembly for a plug-in lamp and a method for assembling sameTRICON IND INC·Filed 1996·Granted Sep 1, 1998·44 cites·13 claims
- 0580US8237243B2On-chip capacitors with a variable capacitance for a radiofrequency integrated circuitDALEY DOUGLAS M·Filed 2009·Granted Aug 7, 2012·8 cites·16 claims
- 0674US8809144B2On-chip capacitors with a variable capacitance for a radiofrequency integrated circuitDALEY DOUGLAS M·Filed 2012·Granted Aug 19, 2014·3 cites·14 claims
- 0771US5243024AHigh moduli polyimidesAMOCO CORP·Filed 1990·Granted Sep 7, 1993·19 cites·13 claims
- 0866US6039579ASealed socket assembly for a plug-in lamp and a method for assembling sameTRICON IND INC·Filed 1998·Granted Mar 21, 2000·23 cites·4 claims
- 0964US9171673B2On-chip capacitors with a variable capacitance for a radiofrequency integrated circuitIBM·Filed 2014·Granted Oct 27, 2015·1 cites·3 claims
- 1057US7739636B2Design structure incorporating semiconductor device structures that shield a bond pad from electrical noiseIBM·Filed 2007·Granted Jun 15, 2010·1 cites·7 claims
- 1148US11610839B2Dummy fill structuresGLOBALFOUNDRIES US INC·Filed 2019·Granted Mar 21, 2023·0 cites·19 claims
- 1245US2014008907A1Method and coupler for joining polymeric tubular objectsTHERCOM HOLDINGS LLC·Filed 2013·Application pending·0 cites
- 1344US2009020856A1Semiconductor device structures and methods for shielding a bond pad from electrical noiseIBM·Filed 2007·Application pending·0 cites
- 1442US2014008004A1Method and coupler for joining polymeric tubular objectsDYKSTERHOUSE JOEL A·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Edward J. Gordon files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →