Inventor · disambiguated record
Bidyut Sen
Also filed as: SEN BIDYUT · SEN BIDYUT K · SEN BIDYUT KANTI
21 granted patents·5 pending applications·687 citations·filing 1990–2024
95Inventor score
Top patents by PatentIndex Score
26 records- 0195US5173766ASemiconductor device package and method of making such a packageLSI LOGIC CORP·Filed 1990·Granted Dec 22, 1992·342 cites·5 claims
- 0288US5304743AMultilayer IC semiconductor packageLSI LOGIC CORP·Filed 1992·Granted Apr 19, 1994·84 cites·7 claims
- 0385US8898365B2Micro-link high-bandwidth chip-to-chip busMASLEID ROBERT P·Filed 2012·Granted Nov 25, 2014·11 cites·20 claims
- 0485US7007741B2Conformal heat spreaderSUN MICROSYSTEMS INC·Filed 2002·Granted Mar 7, 2006·43 cites·4 claims
- 0580US2024427088A1Composite connector carrying power, electro-optical data, and fluid input/outputCISCO TECH INC·Filed 2024·Application pending·0 cites
- 0678US6956285B2EMI grounding pins for CPU/ASIC chipsSUN MICROSYSTEMS INC·Filed 2003·Granted Oct 18, 2005·29 cites·38 claims
- 0777US5414222AMultilayer IC semiconductor packageLSI LOGIC CORP·Filed 1993·Granted May 9, 1995·48 cites·4 claims
- 0874US5817533AHigh-yield methods of fabricating large substrate capacitorsFUJITSU LTD·Filed 1996·Granted Oct 6, 1998·43 cites·26 claims
- 0971US12158616B2Composite connector carrying power, electro-optical data, and fluid input/outputCISCO TECH INC·Filed 2021·Granted Dec 3, 2024·0 cites·20 claims
- 1070US7754343B2Ternary alloy column grid arrayORACLE AMERICA INC·Filed 2005·Granted Jul 13, 2010·5 cites·6 claims
- 1170US6472900B1Efficient device debug systemSUN MICROSYSTEMS INC·Filed 2001·Granted Oct 29, 2002·16 cites·20 claims
- 1268US12483813B2Aggregation of multiplexed optical transceivers in server chassis to establish fabric topologyCISCO TECH INC·Filed 2023·Granted Nov 25, 2025·0 cites·6 claims
- 1359US6754616B1Method of emulating an ideal transformer valid from DC to infinite frequencyFUJITSU LTD·Filed 2000·Granted Jun 22, 2004·7 cites·16 claims
- 1458US6894513B2Multipoint plane measurement probe and methods of characterization and manufacturing using sameSUN MICROSYSTEMS INC·Filed 2003·Granted May 17, 2005·9 cites·22 claims
- 1557US6246252B1Efficient debug package designSUN MICROSYSTEMS INC·Filed 1999·Granted Jun 12, 2001·21 cites·14 claims
- 1656US7571059B2Mechanism for determining an accelerated test specification for device elementsSUN MICROSYSTEMS INC·Filed 2006·Granted Aug 4, 2009·1 cites·18 claims
- 1754US11604755B2Processor socket bridge for input/output extensionCISCO TECH INC·Filed 2021·Granted Mar 14, 2023·0 cites·20 claims
- 1853US8116097B2Apparatus for electrically coupling a semiconductor package to a printed circuit boardLOVE DAVID G·Filed 2007·Granted Feb 14, 2012·2 cites·18 claims
- 1953US6925616B2Method to test power distribution systemSUN MICROSYSTEMS INC·Filed 2002·Granted Aug 2, 2005·6 cites·17 claims
- 2044US2007080441A1Thermal expansion compensation graded IC packageKIRKMAN SCOTT·Filed 2005·Application pending·0 cites
- 2144US2007059548A1Grid array package using tin/silver columnsSUN MICROSYSTEMS INC·Filed 2005·Application pending·0 cites
- 2243US5701071ASystems for controlling power consumption in integrated circuitsFUJITSU LTD·Filed 1995·Granted Dec 23, 1997·9 cites·27 claims
- 2339US10491701B2Interconnect method for implementing scale-up serversCISCO TECH INC·Filed 2016·Granted Nov 26, 2019·0 cites·16 claims
- 2438US6252760B1Discrete silicon capacitorSUN MICROSYSTEMS INC·Filed 1999·Granted Jun 26, 2001·11 cites·4 claims
- 2535US2003107116A1Windowframe capacitorFiled 2001·Application pending·0 cites
- 2634US2019075158A1Hybrid io fabric architecture for multinode serversCISCO TECH INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →