Inventor · disambiguated record
Kenichiro Suetsugu
Also filed as: SUETSUGU KENICHIRO
29 granted patents·5 pending applications·485 citations·filing 1986–2014
97Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD25FURUSAWA AKIO2PANASONIC CORP2NAKAYA KIMIAKI1SAKATANI SHIGEAKI1
Top patents by PatentIndex Score
34 records- 0192US4834545AMultiple fluid mixing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1986·Granted May 30, 1989·83 cites·10 claims
- 0287US8598464B2Soldering material and electronic component assemblySAKATANI SHIGEAKI·Filed 2010·Granted Dec 3, 2013·10 cites·4 claims
- 0383US7780057B2Soldering apparatus and soldering methodPANASONIC CORP·Filed 2008·Granted Aug 24, 2010·8 cites·10 claims
- 0474US7540078B1Method for recycling wastes of an electrical appliancePANASONIC CORP·Filed 2000·Granted Jun 2, 2009·17 cites·2 claims
- 0574US5198655AImage reading device having a light waveguide means widened toward an end nearest to an image surfaceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1991·Granted Mar 30, 1993·36 cites·3 claims
- 0673US5118458AMethod for molding an article integrated with a multi-layer flexible circuit and an apparatus for carrying out the methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1991·Granted Jun 2, 1992·39 cites·7 claims
- 0771US6267823B1Solder, solder paste and soldering methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jul 31, 2001·20 cites·5 claims
- 0870US5498575ABonding film member and mounting method of electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Mar 12, 1996·31 cites·16 claims
- 0968US6657135B2Connection structure and electronic circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Dec 2, 2003·16 cites·22 claims
- 1067US6702175B1Method of soldering using lead-free solder and bonded article prepared through soldering by the methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Mar 9, 2004·12 cites·14 claims
- 1167US5962133ASolder, electronic component mounted by soldering, and electronic circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Oct 5, 1999·32 cites·8 claims
- 1267US5136150AImage sensor having light guides for communication with image planeMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1990·Granted Aug 4, 1992·26 cites·4 claims
- 1365US9656351B2Solder material and connected structureUNIV HIROSHIMA·Filed 2014·Granted May 23, 2017·2 cites·19 claims
- 1465US6805282B2Flow soldering process and apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Oct 19, 2004·12 cites·8 claims
- 1565US6325279B1Solder alloy of electrode for joining electronic parts and soldering methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Dec 4, 2001·9 cites·1 claims
- 1664US6077477ASolder alloy of electrode for joining electronic parts and soldering methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jun 20, 2000·20 cites·4 claims
- 1761US7176402B2Method and apparatus for processing electronic partsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Feb 13, 2007·8 cites·16 claims
- 1860US5113470AOptical wave guide sheet comprising plurality of doubly-clad core members with light scatterers in outer claddingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1989·Granted May 12, 1992·19 cites·2 claims
- 1958US8227090B2Bonding material, electronic component, bonding structure and electronic deviceFURUSAWA AKIO·Filed 2007·Granted Jul 24, 2012·1 cites·16 claims
- 2058US6428745B2Solder, solder paste and soldering methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Aug 6, 2002·4 cites·1 claims
- 2154US2008210604A1Article having a circuit soldered with parts and method for recycling wastes of the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 2251US5052776AOptical waveguide and an image sensor using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1990·Granted Oct 1, 1991·15 cites·4 claims
- 2350US7047635B2Connecting material and connecting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 23, 2006·3 cites·64 claims
- 2450US5743007AMethod of mounting electronics componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Apr 28, 1998·15 cites·14 claims
- 2546US5037233ABicycle frameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1989·Granted Aug 6, 1991·16 cites·3 claims
- 2645US6052893AProcess for manufacturing a resin-encapsulated electronic productMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Apr 25, 2000·12 cites·6 claims
- 2745US5858481AElectronic circuit substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jan 12, 1999·12 cites·12 claims
- 2844US8132707B2Flow soldering apparatus and flow soldering method using a water content sensorNAKAYA KIMIAKI·Filed 2009·Granted Mar 13, 2012·0 cites·16 claims
- 2944US6607116B2Method and apparatus for estimating quality of lead-free solder material and process and system for flow solderingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Aug 19, 2003·1 cites·19 claims
- 3043US2010294550A1Bonding material, electronic component and bonded structureFURUSAWA AKIO·Filed 2008·Application pending·0 cites
- 3141US2001025875A1Solder, solder paste and soldering methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Application pending·0 cites
- 3237US6074894AMounting method of semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jun 13, 2000·6 cites·8 claims
- 3337US2004144829A1Method of soldering lead-free solder, and joined object soldered by the soldering methodFiled 2004·Application pending·0 cites
- 3433US2002179690A1Flux applying method, flow soldering method and devices therefor and electronic circuit boardFiled 2001·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →