Inventor · disambiguated record
Seiji Takemura
Also filed as: TAKEMURA SEIJI
14 granted patents·2 pending applications·464 citations·filing 1975–2010
94Inventor score
Top patents by PatentIndex Score
16 records- 0193US5735040AMethod of making IC cardMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Apr 7, 1998·122 cites·8 claims
- 0280US5677568AThin IC cardMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Oct 14, 1997·62 cites·7 claims
- 0380US5333505ASemiconductor pressure sensor for use at high temperature and pressure and method of manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Aug 2, 1994·64 cites·19 claims
- 0480US4065233AElectric blower assembly having volute passages to direct air into motor housingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1975·Granted Dec 27, 1977·36 cites·5 claims
- 0576US8419102B2Cargo net deviceTAKEMURA SEIJI·Filed 2010·Granted Apr 16, 2013·8 cites·8 claims
- 0665US5166099AManufacturing method for semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Nov 24, 1992·39 cites·6 claims
- 0763US5225373AMethod of manufacturing semiconductor pressure sensor device with two semiconductor pressure sensor chipsMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Jul 6, 1993·35 cites·1 claims
- 0861US5196917ACarrier tapeMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Mar 23, 1993·26 cites·3 claims
- 0954US5126813ASemiconductor pressure sensor device with two semiconductor pressure sensor chips and a method of manufacturing thereofMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Jun 30, 1992·25 cites·10 claims
- 1050US5324985APackaged semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Jun 28, 1994·23 cites·8 claims
- 1145US5251107ASemiconductor packageMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Oct 5, 1993·17 cites·6 claims
- 1237US2011315731A1Cargo retainer device for vehicleTAKEMURA SEIJI·Filed 2010·Application pending·0 cites
- 1336US8444197B2Cargo net deviceTAKEMURA SEIJI·Filed 2010·Granted May 21, 2013·0 cites·18 claims
- 1436US5157472ASemiconductor acceleration sensorMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Oct 20, 1992·5 cites·2 claims
- 1532US2012145338A1Cover apparatus for vehicleTAKEMURA SEIJI·Filed 2010·Application pending·0 cites
- 1627US5187565ALiquid sealed semiconductor device and method of assembling the sameMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Feb 16, 1993·2 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →