Inventor · disambiguated record
Thomas P. Kempf
Also filed as: KEMPF THOMAS · KEMPF THOMAS P
11 granted patents·1 pending application·401 citations·filing 1981–2010
92Inventor score
Top patents by PatentIndex Score
12 records- 0195US6531423B1Liquid-phase-sintered SiC shaped bodies with improved fracture toughness and a high electric resistanceWACKER CHEMIE GMBH·Filed 2000·Granted Mar 11, 2003·110 cites·7 claims
- 0291US8146799B2Product information systems and methodsKEMPF THOMAS P·Filed 2010·Granted Apr 3, 2012·35 cites·26 claims
- 0384US6572911B1Impingement oven with steam injection and method of baking dough productsPILLSBURY CO·Filed 2000·Granted Jun 3, 2003·76 cites·34 claims
- 0467US5209939AMethod for controlling the weight of cut pieces of doughPILLSBURY CO·Filed 1992·Granted May 11, 1993·41 cites·9 claims
- 0563US5189944AAutomated french fry cooking apparatusBURGER KING CORP·Filed 1991·Granted Mar 2, 1993·53 cites·16 claims
- 0656US5073391ASemi-solid food depositor and method of usePILLSBURY CO·Filed 1991·Granted Dec 17, 1991·32 cites·15 claims
- 0755US4474637ALabeling machine and labelBRAND OTTO GMBH·Filed 1981·Granted Oct 2, 1984·18 cites·6 claims
- 0850US4426241ABelt loop fabricating apparatus and methodBRAND OTTO GMBH·Filed 1982·Granted Jan 17, 1984·17 cites·17 claims
- 0947US2007148301A1Dough forming processFINKOWSKI JAMES W·Filed 2006·Application pending·0 cites
- 1046US5898008APore-free sintered bodies on the basis of silicon carbide which are suitable as substrates for hard disks, and methods for the fabrication thereofWACKER CHEMIE GMBH·Filed 1997·Granted Apr 27, 1999·8 cites·6 claims
- 1141US5360118APea separating process using diatomaceous earthPILLSBURY CO·Filed 1993·Granted Nov 1, 1994·9 cites·11 claims
- 1229US5694809ADough sheet sensorPILLSBURY CO·Filed 1995·Granted Dec 9, 1997·2 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Thomas P. Kempf files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →