Inventor · disambiguated record
Jonathan J. Fain
Also filed as: FAIN JONATHAN J · Fain Jonathan
4 granted patents·2 citations·filing 2016–2019
58Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0168US9799637B2Semiconductor package with lid having lid conductive structureQORVO US INC·Filed 2016·Granted Oct 24, 2017·2 cites·19 claims
- 0252US10840165B2Electronics package with improved thermal performanceQORVO US INC·Filed 2019·Granted Nov 17, 2020·0 cites·19 claims
- 0347US10325828B2Electronics package with improved thermal performanceQORVO US INC·Filed 2017·Granted Jun 18, 2019·0 cites·20 claims
- 0435US10008473B2Power package lidTRIQUINT SEMICONDUCTOR INC·Filed 2016·Granted Jun 26, 2018·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →