Inventor · disambiguated record
Kong Bee Tiu
Also filed as: TIU KONG B · TIU KONG BEE
9 granted patents·4 pending applications·201 citations·filing 2002–2014
88Inventor score
Technology areasH10W
Top patents by PatentIndex Score
13 records- 0195US7160755B2Method of forming a substrateless semiconductor packageFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jan 9, 2007·58 cites·17 claims
- 0292US6885093B2Stacked die semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Apr 26, 2005·80 cites·14 claims
- 0387US7211466B2Stacked die semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted May 1, 2007·16 cites·8 claims
- 0483US9190352B2Multi-die sensor deviceTIU KONG BEE·Filed 2013·Granted Nov 17, 2015·8 cites·10 claims
- 0573US6854637B2Wirebonding insulated wireFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Feb 15, 2005·22 cites·23 claims
- 0669US8981541B2Quad flat semiconductor device with additional contactsTIU KONG BEE·Filed 2013·Granted Mar 17, 2015·3 cites·9 claims
- 0760US7261230B2Wirebonding insulated wire and capillary thereforFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Aug 28, 2007·14 cites·22 claims
- 0845US9209120B2Semiconductor package with lead mounted power barTIU KONG BEE·Filed 2014·Granted Dec 8, 2015·0 cites·14 claims
- 0940US9305898B2Semiconductor device with combined power and ground ring structureTIU KONG BEE·Filed 2014·Granted Apr 5, 2016·0 cites·10 claims
- 1038US2007200225A1Heat sink for semiconductor packageIBRAHIM RUZAINI·Filed 2006·Application pending·0 cites
- 1138US2014374848A1Semiconductor sensor device with metal lidKOH WEN SHI·Filed 2013·Application pending·0 cites
- 1237US2007026573A1Method of making a stacked die packageISMAIL AMINUDDIN·Filed 2005·Application pending·0 cites
- 1332US2003230796A1Stacked die semiconductor deviceFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →